Update at July 15, 3:00 a.m. PDT with additional information and corrections concerning the Intel-Nvidia dispute.
Nvidia said Monday that its multichip technology will be architected to work on Intel's upcoming Nehalem chip platform.
Nvidia SLI technology supports multiple graphics boards.
(Credit: Nvidia)This announcement may help Nvidia to work around a standoff with Intel over whether Nvidia can make chipsets that work with Intel's next-generation Nehalem platform, due later this year. And also demonstrates that despite Nvidia CEO Jen-Hsun Huang' s rhetoric, Nvidia must cooperate with Intel in order to thrive.
Monday's announcement has no relation to separate licensing negotiations, according to sources familiar with the discussions. In other words, Nvidia is not announcing a chipset for Nehalem--which would require a license. It is simply a statement that Nvidia will support Nehalem with its nForce 200 Scalable Link Interconnect (SLI) chip.
However, some reports say Nvidia has reached an agreement with Intel to license Intel's Quick Path Interconnect (QPI) technology, paving the way for Nvidia to design chipsets for Nehalem.
The nForce 200 chip will work with Intel's "Bloomfield" line of Nehalem processors and the accompanying Intel chipset. SLI allows Nvidia to use multiple graphics boards in one system.
Upcoming SLI motherboards will use Nvidia nForce 200 SLI silicon, Intel Bloomfield processors, and Intel Tylersburg (X58) chipsets, Nvidia said in a statement.
"The nForce 200 SLI processor features patented SLI technology for graphics bandwidth management and multi-GPU peer-to-peer communications, both required to optimize graphics performance," Nvidia said. GPU stands for graphics processing unit.
Future systems "can be powered by one, two, or even three Nvidia GeForce GPUs, including the new...GeForce GTX 280 and GTX 260 GPUs," according to Nvidia.
Nvidia included statements from system suppliers in the Monday release. "It's great to see that Nvidia opted to enable SLI on the future Intel Bloomfield platform," said Rahul Sood, CTO Voodoo Business Unit, HP. "Make love not war I say...and Nvidia's (enabling) of Intel chipsets to support SLI will make our jobs much easier."
Nvidia claims that nForce 200 SLI silicon with Intel's new Bloomfield processor and Tylersburg chipset core logic chipset will deliver up to a 2.8X performance boost over traditional single graphics card platforms.
Motherboards and PC systems that will use the Nvidia nForce 200 SLI chip, Nvidia GeForce GPUs, and Nvidia SLI technology will be available from companies such as Acer, ASUS, Dell, Falcon Northwest, Legend, and Velocity Micro.
Intel has upstaged Advanced Micro Devices at DreamWorks Animation. The movie studio has decided to drop AMD and go with processors from Intel, citing better performance and a more promising roadmap.
DreamWorks specifically mentioned Intel's upcoming Nehalem processor and Larrabee graphics chip as reasons for the switch.
Intel and DreamWorks announced Tuesday that they had formed a strategic alliance for 3D filmmaking technology. DreamWorks plans to produce all its feature films in stereoscopic 3D--which requires the viewer to wear special glasses for enhanced 3D--beginning next year. Intel will provide DreamWorks with "the latest high-performance processing technologies, including future chips with multiple processing cores," the companies said.
This is a setback for AMD. The Sunnyvale, Calif.-based chipmaker rolled out its quad-core Barcelona last year at George Lucas' Lucasfilm campus in San Francisco to make a point: Barcelona would be big player in the movie industry. But a series of delays related to a processor bug put a damper on the high expectations for Barcelona.
"AMD maintained a long and fruitful relationship with DreamWorks Animation, beginning in early 2005. Earlier this year, AMD and DreamWorks decided not to extend our marketing and technology relationship. However, DreamWorks Animation is still an important and respected AMD customer and we look forward to having the opportunity to work with them again in the future," AMD said in a statement.
Essentially, DreamWorks looked down the road and liked what it saw coming from Intel better. "When we look at the Intel roadmap, it is more closely aligned with our needs," John Batter, president of production at DreamWorks Animations, said during a conversation with Nanotech: The Circuits blog. "The rendering times have been going up because of the complexity and richness of the images. Then you layer on top of that 3D. Something that's already growing--and doubling it."
Intel had the best technology, Batter said. "You need a lot more horsepower. On Intel's upcoming generation, the number of cores is going to help us satiate the big spike in our needs."
DreamWorks had been in a three-year partnership with AMD, Batter said.
He explained that Intel is also helping DreamWorks to redesign its animation tools. "Our animation tools are all proprietary here. Intel is rearchitecting our software tools...to take advantage of multicore and make our renderer highly scalable as well as making our character animation tools highly scalable."
DreamWorks uses rendering farms with as many as 5,000 cores to create animation and its tools need to be adapted to the increasing number of processor cores, Batter said. The Nehalem chip, for example, is expected to integrate as many as eight cores. Currently, Intel offers no more than four cores per chip. Larrabee is expected by many to offer as many as 32 cores.
Intel Nehalem architecture
(Credit: Intel)Batter specifically mentioned both Nehalem and Larrabee as a reason for the switch to Intel. He said that Larrabee would be "complementary" to Intel's general-purpose CPUs.
Nehalem is due in the fourth quarter of this year and Larrabee is expected in the 2009-2010 time frame.
The first Intel-Dreamworks release will be Monsters vs. Aliens, which is slated to hit movie theaters in March 2009.
An Intel paper to be released Tuesday offers more details on future Nehalem processors.
Rajesh Kumar, Intel fellow and director of the Circuit & Low Power Technologies Digital Enterprise Group, gave a brief overview of a paper covering "clocking architecture" and some of the major data transfer and power savings goals for Nehalem, Intel's next-generation chip architecture due in the fourth quarter of this year. One of Nehalem's major new features is QuickPath (PDF), a data transfer technology.
He began by explaining why Nehalem integrates more components--including the memory controller--than previous Intel chips. "The reason we are doing this is to get lower latency to memory. And much higher bandwidth to memory," he said.
Kumar said Nehalem will deliver "25 gigabytes per second for socket to socket (chip to chip) communication. And 32 gigabytes per second going to main memory."
"We're about 3X faster than our competition today," he claimed.
Intel paper details Nehalem communication speeds
(Credit: Intel)He also described how Intel is doing more to optimize power saving over previous generations of processors. "The number of cores and most of its features are modular. You can change the number of cores in different segments, for example. But just doing that is not sufficient. Because we're going to emphasize energy efficiency for some cases and high performance for others, we also needed to makes these things scalable," he said.
He went on to describe how the processors can be scaled for different markets. "As a result, we had to make all the main components work in a decoupled fashion. Such that frequencies and voltages can all be set independently. The CPU core, for example, can be running at its own frequency and voltage, while the memory system is running on its own, and the I/O (Input/Output) is running on its own, and each of them can be tuned for a given segment."
Kumar said the technology itself isn't new, but that Intel's technique is different than its competitors. "The idea itself is not new but the implementation is new. So far, most people that have tried this idea have done this using what are called asynchronous interfaces which happen to be fairly slow. So the main idea is how to do all of this in a synchronous fashion with very low latency and high performance," he said.
He also described how Nehalem chips are better tuned to operate based on the level of power delivered. "Chips today run at a given frequency, at a given voltage. But we know that when running different applications the power supply keeps moving around," he said. "What we have introduced is a chip whose frequency keeps adapting every cycle to the dynamic and real time power supply it actually sees."
In related news. Chinese-language Website HKEPC is showing three versions of the Nehalem processor. The "Bloomfield" XE running at 3.2GHz, another running at 2.93GHz, and third at 2.66GHz. All have four processing cores that run eight threads, all have 8MB of level-3 cache memory, and all have a thermal envelope of 130 watts.
The XE has a QuickPath data transfer rate of 6.4 gigatransfers per second (GTs). The other two deliver 4.8GTs.
All are due in the fourth quarter.
This started out as a rumor today, but Intel has since more-or-less confirmed that licensing discussions between Intel and Nvidia for Intel's next-generation processors are not going well and the resulting conflict could have implications for high-end gaming PCs.
We have no official confirmation from Nvidia on this, and Intel's statement from PR manager Dan Snyder is vague, but it lends credence to the story:
"There is a disagreement between Intel and Nvidia as to the scope of Nvidia's license from Intel to make chipsets compatible with Intel microprocessors. Intel is trying to resolve the disagreement privately with Nvidia and therefore we will not provide additional details. It is our hope that this dispute will be resolved amicably and that it will not impact other areas of our companies' working relationship."
Intel has been after SLI support for its chipsets for years, but has thus far only been able to build it into its ultra high-end Skulltrail motherboards, seemingly a one-off. With SLI available across all of its chipset lines, Intel would be able to sell motherboards that support both AMD's and Nvidia's multigraphics card technologies. Right now Intel boards (with the exception of Skulltrail) only support AMD's CrossFire.
Nvidia, on the other hand, has kept SLI close, often citing compatibility and certification concerns as the reason why no other chipset vendor has been able to offer SLI-capability. But if Nvidia loses out on Nehalem for its next-generation chipsets, the high-end desktop market will become more fragmented than it's been in years. Nvidia has been able to offer SLI-supporting chipsets for both AMD and Intel processors, but if this split happens, on one side we'll have Nehalem and CrossFire-based systems, the other will offer SLI (and possibly CrossFire, if hacks used in the past continue to work) and AMD CPUs.
In light of this rumor, Nvidia's recent marketing push encouraging upgraders to pick a graphics card before a quad-core CPU takes on new significance. If Nvidia knows high-end PC gamers will have to make a choice later this year, better to plant the seeds in its favor early. Intel probably has less to worry about, because gamers who demand SLI with a fast Intel processor can still use Nvidia's NForce 790i chipset, which supports the current generation of Intel Core 2 Extreme chips.
UPDATE 5:48pm PT - Intel released an additional statement after this blog was posted. "We are not seeking any SLI concession from Nvidia in exchange for granting any Nehalem license rights to Nvidia," the company said.
Staff writer Tom Krazit contributed to this report.
Intel has started shipping its long awaited low-power chip for wireless devices, but the company is clearly starting at the high end of the market.
The Centrino Atom--which took almost four years to develop--is the world's fastest chip under 3 watts of power, according to Intel. The first Atoms run at speeds up to 1.8GHz and sport a thermal ceiling of 0.65 to 2.4 watts. By contrast, the average laptop chip runs at 3.3GHz and consumes 35 watts at a peak.
The company unveiled the chip at the Intel Developer Forum taking place in Shanghai this week. Intel also said that the first chips based around Nehalem, a new chip architecture for desktops, notebooks and servers, will come out this year. Nehalem is designed to go up to eight cores. (Hubba, hubba.)
Then there is a whole new architecture coming in 2010 code-named Sandy Bridge.
Atom will probably get the most attention at the show. Intel has been trying to play a bigger part in the wireless market for years and create new categories of devices for wireless, cranking out another chapter in the so-called "new users, new uses" strategy. Intel will initially aim Atom at "pocketable devices" which can play movies, hold hours of music, and let users scroll the Internet. A few companies like OQQ and Samsung have come out with ultra-portables like this. They haven't sold in huge numbers. The first devices with Atom will sell for around $400 to $600.
The mobile sector is the fastest-growing category in the semiconductor business and Intel wants to be in there to compete with companies such as Dallas-based Texas Instruments, Samsung Electronics, Qualcomm, and STMicroelectronics.
"The architecture is going to be able to bring all the PC functionalities, what you saw in the market in 2003 and 2004," Gary Willihnganz, director of marketing in Intel's mobile group, said in a conference call from Shanghai on Tuesday.
To help convince wireless handset makers to select its chip, Intel promises a "seven year extended life support." That is, handset makers will be able to get chips and support for seven years for the same processor. Handset and consumer electronics device makers change internal silicon slower than PC makers.
The company presented a list of around 20 manufacturers, 10 service providers, and a big group of software companies that have signed on to work with Intel. How many come out with devices remains to be seen, but it's a start. In the past, Intel has kicked off mobile phone efforts with less support.
News.com's Michael Kanellos contributed to this story.
While the marquee processor theme at IDF Shanghai is "milliwatts to petaflops," Intel is also set to offer a vision of universal connectivity.
The main theme for the event, which starts Wednesday, Beijing time, refers to "very, very big to very, very small and low power," according to Pat Gelsinger, senior vice president and co-general manager of Intel's digital enterprise group, speaking in a video.
(See: Intel rolls out five new Atom processors.)
"Milliwatts" refers to chips such as Atom, a tiny low-power, low-cost processor destined for ultramobile devices and low-cost desktops typically running either Linux or Windows XP. The first Atom chips will launch in June.
"Petaflops" refers to high-performance computing--what used to be called supercomputing. ("Peta" is quadrillion, or a thousand trillion; "flop" is floating-point operation.) Intel is targeting petaflop supercomputers that would compete with the fastest supercomputer in the world: IBM's Blue Gene/P machines.
Though more technology and product details will certainly emerge in the next two days in Shanghai, the main chip themes are already out there. Gelsinger spelled them out at briefing earlier this month.
The specs for Intel's Dunnington processor
(Credit: Intel)The chip buzzwords are: Tukwila, a new quad-core chip with 2 billion transistors, a whopping 30MB of cache, and a new interconnect technology called QuickPath; Dunnington, a six-core chip for multiprocessor computers that can support four or more processors (in this case, each with six cores); Nehalem, a follow-on to the current "Penryn" processors, it is a new 45-nanometer chip microarchitecture due in the fourth quarter that scales up to eight cores; and Larrabee, a visual-computing architecture that uses many cores ("many" usually means many more than a typical quad-core computer).
In addition to Atom, the processor spotlight will likely fall on Nehalem and Larrabee. Nehalem is a relatively known quantity; Larrabee, a relatively unknown quantity. So interest should focus on the latter.
Nehalem boasts increased parallelism, better branch prediction (to move instructions more quickly through the instruction pipeline), and an on-chip memory controller for increased memory performance--what Intel calls "memory latency reduction." Something, by the way, Advanced Micro Devices already has in its chips.
Larrabee is a graphics processor scheduled for the 2009-2010 time frame. It will include a new vector instruction set to improve the performance of graphics and video applications. Larrabee will be compatible with Intel's popular x86 instruction set, theoretically making life easier for software developers.
On another front, Intel is evangelizing universal connectivity, always a problematic proposition, simply because it invariably promises more (sometimes much more) than it can deliver. Intel puts it this way: "Imagine a day when a single device small enough to fit in your pocket...knows your tendencies and preferences and can adapt and optimize its interfaces to match what you are doing at any point any time...Imagine a day when this device...can dynamically become a hybrid combination of other computing and multimedia devices in close proximity." You get the picture. Intel calls this "Carry Small, Live Large."
On a slightly more practical level, the Cliffside technology is being demonstrated from the Mobile Products Group; it enables a single Wi-Fi adapter to function like two independent Wi-Fi adapters. The hope is that this technology could sync your MP3 and video files without a USB cable, directly and wirelessly connecting your notebook to your TV to view HD movies. More here.
There is also a demonstration of wireless device discovery and setup. This demonstration shows how to detect and connect to nearby wireless displays, using the familiar FnF7 (Function F7 key combination).
The following is a partial list of the sessions at this week's Intel Developer Forum in China, which runs April 2 to 3. Topics set to be covered at IDF Shanghai include Netbook, Nettop, Bloomfield (Nehalem), solid-state drives, QuickAssist (accelerators), system-on-chip (Tolapai), and USB 3.0.
The items below are taken directly from Intel's own material:
Intel Atom Processor for the Desktop
The Essential Building Block for Purpose Built, Basic Desktop Computing Devices: Intel's strategy for basic desktop computing devices. See how the new Intel Atom processor based desktop platforms provide the world's best solution for basic computing, content consumption, and thin client.
Intel Basic Mobile Platform with Intel Atom Processor: Growing New Markets
Overview of growth opportunities for internet-centric computing devices or netbook market. Introduction to 2008 Basic Mobile Platform with Intel Atom Processor Architecture. Understand low cost system BOM (Bill Of Materials) & implications for netbooks. How netbooks are different from Mobile Internet devices, Ultra Mobile PCs, and Entry Notebooks. Opportunities for OEMs/ODM/Software community.
The Intel-Powered Classmate PC: Innovating for the Future
An introduction to technology for the next billion users and how to designing a product for first time user in environments that are not ideal. This includes the implementation of specific technical features in the Second and Next Generation Intel-powered classmate PC including: - PATA MLC Flash - Rugged and high temperature tolerant parts/design - Fan-less thermal system design.
Passive and Fanless Thermal Enabling for Affordable Internet-Centric Nettop
Introduction of Nettop, internet-centric computing devices roadmap and associated thermal solution space. Value proposition of passive/fanless cooling - Cost, Noise, new usage.
High End Desktop Platform, Next Generation (Nehalem) Processor
Background on the Desktop version of our Next Generation Intel Microarchitecture (Nehalem) Processor. Key electrical and system design guidelines to consider in designing a platform with the new Intel desktop processor (Bloomfield). Information on the new Quick Path Interconnect (QPI) & the Integrated Bus Controller on the new Intel desktop processor (Bloomfield) processor. Updates on other key new technologies of this High End Desktop platform and the advantages they bring to developers
Microsoft Windows Rally Technologies
The Windows Rally technologies provide manufacturers of network-connected devices with an architecture that enables effortless setup, more secure and manageable connectivity to other devices and computers, and rich end-user experiences. Using Windows Rally technologies enables hardware and software developers to focus development resources on product differentiation rather than connectivity fundamentals. For our mutual consumers, the result will be a dramatic reduction in complexity. Connecting a network device to a PC will be effortless, reliable, and more secure.
SATA Solid-State Drives: Not All Drives are Created Equal
A technical overview of NAND-based high-performance SATA solid-state drive (SSD) technology. A comparative review between Intel's upcoming SATA SSD products and other SSD and conventional hard disk drive alternatives, focusing on the areas of performance, power and reliability
DDR3, the Optimal Memory for Notebooks
Understand the benefits of DDR3 memory. Understand the DDR3 eco-system readiness and outlook for Mobile. Learn how memory impacts critical performance and power benchmarks and what these benchmarks mean to end-users.
Extreme Mobile Gaming: Design Considerations for High Performance Notebooks
Introduction to Extreme Edition Gaming Notebooks. Details on Extreme Edition Notebook hardware & software offerings. Updates on available Thermal technologies. Methods to tune platform performance
Inside Intel Next Generation Nehalem Microarchitecture
Intel's Nehalem microarchitecture is the next major microarchitecture update from Intel aligning to it's "Tick-Tock" cadence for processors. This session will provide architectural insight into this new microarchitecture that will start shipping in the second half of 2008. You will learn the details behind the key microarchitecture features including: Enhancements to the out of order execution engine. Enhancement to the Platform bandwidth. Enhancements to the cache subsystem. Extension to the instruction set with SSE4.2. And more...
Intel QuickAssist Technology Components
Understanding of the scope of Intel QuickAssist Acceleration Technology and Components. Hardware and software architecture of Intel QuickAssist Technology FSB-FPGA Accelerators and AAL. Learn about the Integrated Accelerator & Intel's new System On Chip Product (Tolapai). Hardware and software architecture framework of Tolapai
Moblin.org - Open Source Development for the Intel Powered Mobile Internet Device
Moblin.org, the umbrella open source project hosts the core software stack and technologies for Intel powered Mobile Internet Device (MID). This course will go into technical details on Moblin.org, for how you could setup platform-specific environment and build applications based on Moblin.org sub-projects and technologies.
SuperSpeed USB - Fast Sync-N-Go for Mobile Devices
SuperSpeed Market overview and Industry timeline updates. Update on SuperSpeed USB (USB 3.0) specification architecture details. Guidance on industry opportunities for 2008/2009
Intel Architecture Based SoC (System-on-Chip)
Join us to hear about the vision for Intel Architecture-based SoCs and the unique benefits that they bring to the industry. This Technology Insight will focus on a generic SoC on-die architecture and its impact on SoC-based platforms for embedded communications, mobile devices, and consumer electronics. The talk will also outline Intel's expectations of the industry ecosystem in the areas of Electronic System Level (ESL) language, tools, and new methodologies.
During a February earnings conference call, Jen-Hsun Huang, president and CEO of Nvidia, repeated one thing over and over: graphics are in and the central processor is out. There is some truth to this. And Intel's plans for future silicon technology address this head on.
Pat Gelsinger, general manager of the digital enterprise group at Intel, spelled out Intel's strategies for future graphics technology on Monday. He addressed the higher-octane technology that will be built into future "Nehalem" processors and the highly sophisticated "Larrabee" chips that will be offered as "discrete" or standalone products.
First, some perspective. Intel--not Nvidia or ATI--is the world's largest supplier of graphics chips for PCs. The reason is simple. Intel-integrated graphics silicon is shipped in tens of millions of PCs every year. It's a low-cost--and relatively low-performance--solution that many PC vendors opt for. But that doesn't mean Intel is the premier supplier of sophisticated mainstream PC graphics technology. That distinction goes to Nvidia and ATI. Intel is a non-player. This is evidenced by the proliferation of Nvidia- and ATI-based graphics board reviews at enthusiast Web sites and the bigger role that graphics processors from these two companies play in handling increasingly complex visual applications.
And, as the Nvidia CEO has intimated, unless Intel responds aggressively, this could make Nvidia a direct Intel competitor in the future. Nvidia's newest GeForce 9600 GT GPU rivals, at the very least, Intel chips in complexity. It has 64 stream processors--each individually clocked at 1625MHz--and a 256-bit memory interface running at 900MHz and contains more than 500 million transistors.
NvidiaGeForce 9600 GT boards: each Nvidia chip has over 500 million transistors.
(Credit: Nvidia)To address this, Intel intends to boost integrated graphics performance in Nehalem processors and, for the first time, offer a discrete (standalone) graphics product for high-end markets. Both Nehalem and Larrabee are targeted at the 2009-2010 time frame.
So, how will Intel improve Nehalem integrated graphics? Not surprisingly, more transistors and more bandwidth, according to Gelsinger. "Largely, integrated graphics is as much die area as you can throw at it and as much memory bandwidth as you can give it," Gelsinger said. "So, could we equal discrete graphics performance with integrated graphics? Of course." Gelsinger went on to say that Intel will focus on "more transistor budget, leading-edge process technology, and more memory bandwidth dedicated to integrated graphics."
Logistically, this will be accomplished by turning today's three-chip CPU into a two-chip CPU, he said. That means moving the graphics silicon onto the same die with the main processor. More specifically, the part of the chipset referred to as the "north bridge" is going away. The north bridge contains the memory controller and graphics controller. Both of these components will be moved onto the CPU die. The other part of the chipset referred to as the "south bridge" will remain separate. This includes I/O related components.
But Gelsinger said there are definite limits to what can be done with integrated graphics because of the big power and transistor requirements for high-end discrete (standalone) graphics products. They have "a very different price point and die envelope and power envelope. Some of the (discrete) graphics chips alone are 150 watts. We build whole platforms for less (power) than that," he said.
This is where Larrabee comes in. Gelsinger said that Larrabee--a "many core" chip--will target Nvidia and AMD/ATI's discrete graphics. "Obviously, if we're going to be competing in the discrete graphics marketplace, we think we're going to have to compete well...in terms of traditional benchmarks like 3D Mark," he said, adding that Intel will support traditional graphics interfaces such as DirectX and OpenGL. A big potential plus: since Larrabee cores will be based on the Intel Architecture, developers who already write code for standard Intel microprocessors can develop for Larrabee without learning a completely new architecture.
SAN FRANCISCO--This Nehalem plan better work out for Intel, because the chipmaker set very high expectations for the next-generation processor design Tuesday.
Pat Gelsinger, general manager of Intel's Digital Enterprise Group, speaks at Intel Developer Forum in San Francisco.
(Credit: Stephen Shankland/CNET Networks)Pat Gelsinger, general manager of Intel's Digital Enterprise Group, demonstrated a Nehalem-based system at the Intel Developer Forum here that he said will bring major performance improvements for the company's x86 processor line. The processor family itself is due to arrive in 2008.
The Nehalem demonstration featured a system with two quad-core processors; each processing core can handle two independent instruction sequences called threads, and the demo showed all 16 threads at work on various tasks. The processor was the very first incarnation of Nehalem--the "A0" version--built for the first time three weeks ago, Gelsinger said.
"What you saw today was incredible health," he boasted during a meeting with reporters after the speech. "It really is pretty spectacular, and we're excited by the progress."
Nehalem brings major changes not just to the processor but also to the way in which it communicates with memory and other processors, a technology formerly called CSI, which variously stood for Common System Interconnect or Interface, and now branded as QuickPath Interconnect, or QPI. QuickPath reproduces a technique that rival Advanced Micro Devices used for years to market share against Intel and secure a solid position in all four major server makers' product lines.
The Nehalem processors demonstrated Tuesday each had four cores on a single slice of silicon, the approach AMD uses with its new Barcelona member of the Opteron processor family. In 2009, Intel will sell Nehalem processors with eight cores on a single slice of silicon.
Intel also is expected to sell less expensive Nehalem processors with dual cores per die, a source familiar with the company's plans said.
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