Update at July 15, 3:00 a.m. PDT with additional information and corrections concerning the Intel-Nvidia dispute.
Nvidia said Monday that its multichip technology will be architected to work on Intel's upcoming Nehalem chip platform.
Nvidia SLI technology supports multiple graphics boards.
(Credit: Nvidia)This announcement may help Nvidia to work around a standoff with Intel over whether Nvidia can make chipsets that work with Intel's next-generation Nehalem platform, due later this year. And also demonstrates that despite Nvidia CEO Jen-Hsun Huang' s rhetoric, Nvidia must cooperate with Intel in order to thrive.
Monday's announcement has no relation to separate licensing negotiations, according to sources familiar with the discussions. In other words, Nvidia is not announcing a chipset for Nehalem--which would require a license. It is simply a statement that Nvidia will support Nehalem with its nForce 200 Scalable Link Interconnect (SLI) chip.
However, some reports say Nvidia has reached an agreement with Intel to license Intel's Quick Path Interconnect (QPI) technology, paving the way for Nvidia to design chipsets for Nehalem.
The nForce 200 chip will work with Intel's "Bloomfield" line of Nehalem processors and the accompanying Intel chipset. SLI allows Nvidia to use multiple graphics boards in one system.
Upcoming SLI motherboards will use Nvidia nForce 200 SLI silicon, Intel Bloomfield processors, and Intel Tylersburg (X58) chipsets, Nvidia said in a statement.
"The nForce 200 SLI processor features patented SLI technology for graphics bandwidth management and multi-GPU peer-to-peer communications, both required to optimize graphics performance," Nvidia said. GPU stands for graphics processing unit.
Future systems "can be powered by one, two, or even three Nvidia GeForce GPUs, including the new...GeForce GTX 280 and GTX 260 GPUs," according to Nvidia.
Nvidia included statements from system suppliers in the Monday release. "It's great to see that Nvidia opted to enable SLI on the future Intel Bloomfield platform," said Rahul Sood, CTO Voodoo Business Unit, HP. "Make love not war I say...and Nvidia's (enabling) of Intel chipsets to support SLI will make our jobs much easier."
Nvidia claims that nForce 200 SLI silicon with Intel's new Bloomfield processor and Tylersburg chipset core logic chipset will deliver up to a 2.8X performance boost over traditional single graphics card platforms.
Motherboards and PC systems that will use the Nvidia nForce 200 SLI chip, Nvidia GeForce GPUs, and Nvidia SLI technology will be available from companies such as Acer, ASUS, Dell, Falcon Northwest, Legend, and Velocity Micro.
While the marquee processor theme at IDF Shanghai is "milliwatts to petaflops," Intel is also set to offer a vision of universal connectivity.
The main theme for the event, which starts Wednesday, Beijing time, refers to "very, very big to very, very small and low power," according to Pat Gelsinger, senior vice president and co-general manager of Intel's digital enterprise group, speaking in a video.
(See: Intel rolls out five new Atom processors.)
"Milliwatts" refers to chips such as Atom, a tiny low-power, low-cost processor destined for ultramobile devices and low-cost desktops typically running either Linux or Windows XP. The first Atom chips will launch in June.
"Petaflops" refers to high-performance computing--what used to be called supercomputing. ("Peta" is quadrillion, or a thousand trillion; "flop" is floating-point operation.) Intel is targeting petaflop supercomputers that would compete with the fastest supercomputer in the world: IBM's Blue Gene/P machines.
Though more technology and product details will certainly emerge in the next two days in Shanghai, the main chip themes are already out there. Gelsinger spelled them out at briefing earlier this month.
The specs for Intel's Dunnington processor
(Credit: Intel)The chip buzzwords are: Tukwila, a new quad-core chip with 2 billion transistors, a whopping 30MB of cache, and a new interconnect technology called QuickPath; Dunnington, a six-core chip for multiprocessor computers that can support four or more processors (in this case, each with six cores); Nehalem, a follow-on to the current "Penryn" processors, it is a new 45-nanometer chip microarchitecture due in the fourth quarter that scales up to eight cores; and Larrabee, a visual-computing architecture that uses many cores ("many" usually means many more than a typical quad-core computer).
In addition to Atom, the processor spotlight will likely fall on Nehalem and Larrabee. Nehalem is a relatively known quantity; Larrabee, a relatively unknown quantity. So interest should focus on the latter.
Nehalem boasts increased parallelism, better branch prediction (to move instructions more quickly through the instruction pipeline), and an on-chip memory controller for increased memory performance--what Intel calls "memory latency reduction." Something, by the way, Advanced Micro Devices already has in its chips.
Larrabee is a graphics processor scheduled for the 2009-2010 time frame. It will include a new vector instruction set to improve the performance of graphics and video applications. Larrabee will be compatible with Intel's popular x86 instruction set, theoretically making life easier for software developers.
On another front, Intel is evangelizing universal connectivity, always a problematic proposition, simply because it invariably promises more (sometimes much more) than it can deliver. Intel puts it this way: "Imagine a day when a single device small enough to fit in your pocket...knows your tendencies and preferences and can adapt and optimize its interfaces to match what you are doing at any point any time...Imagine a day when this device...can dynamically become a hybrid combination of other computing and multimedia devices in close proximity." You get the picture. Intel calls this "Carry Small, Live Large."
On a slightly more practical level, the Cliffside technology is being demonstrated from the Mobile Products Group; it enables a single Wi-Fi adapter to function like two independent Wi-Fi adapters. The hope is that this technology could sync your MP3 and video files without a USB cable, directly and wirelessly connecting your notebook to your TV to view HD movies. More here.
There is also a demonstration of wireless device discovery and setup. This demonstration shows how to detect and connect to nearby wireless displays, using the familiar FnF7 (Function F7 key combination).
The following is a partial list of the sessions at this week's Intel Developer Forum in China, which runs April 2 to 3. Topics set to be covered at IDF Shanghai include Netbook, Nettop, Bloomfield (Nehalem), solid-state drives, QuickAssist (accelerators), system-on-chip (Tolapai), and USB 3.0.
The items below are taken directly from Intel's own material:
Intel Atom Processor for the Desktop
The Essential Building Block for Purpose Built, Basic Desktop Computing Devices: Intel's strategy for basic desktop computing devices. See how the new Intel Atom processor based desktop platforms provide the world's best solution for basic computing, content consumption, and thin client.
Intel Basic Mobile Platform with Intel Atom Processor: Growing New Markets
Overview of growth opportunities for internet-centric computing devices or netbook market. Introduction to 2008 Basic Mobile Platform with Intel Atom Processor Architecture. Understand low cost system BOM (Bill Of Materials) & implications for netbooks. How netbooks are different from Mobile Internet devices, Ultra Mobile PCs, and Entry Notebooks. Opportunities for OEMs/ODM/Software community.
The Intel-Powered Classmate PC: Innovating for the Future
An introduction to technology for the next billion users and how to designing a product for first time user in environments that are not ideal. This includes the implementation of specific technical features in the Second and Next Generation Intel-powered classmate PC including: - PATA MLC Flash - Rugged and high temperature tolerant parts/design - Fan-less thermal system design.
Passive and Fanless Thermal Enabling for Affordable Internet-Centric Nettop
Introduction of Nettop, internet-centric computing devices roadmap and associated thermal solution space. Value proposition of passive/fanless cooling - Cost, Noise, new usage.
High End Desktop Platform, Next Generation (Nehalem) Processor
Background on the Desktop version of our Next Generation Intel Microarchitecture (Nehalem) Processor. Key electrical and system design guidelines to consider in designing a platform with the new Intel desktop processor (Bloomfield). Information on the new Quick Path Interconnect (QPI) & the Integrated Bus Controller on the new Intel desktop processor (Bloomfield) processor. Updates on other key new technologies of this High End Desktop platform and the advantages they bring to developers
Microsoft Windows Rally Technologies
The Windows Rally technologies provide manufacturers of network-connected devices with an architecture that enables effortless setup, more secure and manageable connectivity to other devices and computers, and rich end-user experiences. Using Windows Rally technologies enables hardware and software developers to focus development resources on product differentiation rather than connectivity fundamentals. For our mutual consumers, the result will be a dramatic reduction in complexity. Connecting a network device to a PC will be effortless, reliable, and more secure.
SATA Solid-State Drives: Not All Drives are Created Equal
A technical overview of NAND-based high-performance SATA solid-state drive (SSD) technology. A comparative review between Intel's upcoming SATA SSD products and other SSD and conventional hard disk drive alternatives, focusing on the areas of performance, power and reliability
DDR3, the Optimal Memory for Notebooks
Understand the benefits of DDR3 memory. Understand the DDR3 eco-system readiness and outlook for Mobile. Learn how memory impacts critical performance and power benchmarks and what these benchmarks mean to end-users.
Extreme Mobile Gaming: Design Considerations for High Performance Notebooks
Introduction to Extreme Edition Gaming Notebooks. Details on Extreme Edition Notebook hardware & software offerings. Updates on available Thermal technologies. Methods to tune platform performance
Inside Intel Next Generation Nehalem Microarchitecture
Intel's Nehalem microarchitecture is the next major microarchitecture update from Intel aligning to it's "Tick-Tock" cadence for processors. This session will provide architectural insight into this new microarchitecture that will start shipping in the second half of 2008. You will learn the details behind the key microarchitecture features including: Enhancements to the out of order execution engine. Enhancement to the Platform bandwidth. Enhancements to the cache subsystem. Extension to the instruction set with SSE4.2. And more...
Intel QuickAssist Technology Components
Understanding of the scope of Intel QuickAssist Acceleration Technology and Components. Hardware and software architecture of Intel QuickAssist Technology FSB-FPGA Accelerators and AAL. Learn about the Integrated Accelerator & Intel's new System On Chip Product (Tolapai). Hardware and software architecture framework of Tolapai
Moblin.org - Open Source Development for the Intel Powered Mobile Internet Device
Moblin.org, the umbrella open source project hosts the core software stack and technologies for Intel powered Mobile Internet Device (MID). This course will go into technical details on Moblin.org, for how you could setup platform-specific environment and build applications based on Moblin.org sub-projects and technologies.
SuperSpeed USB - Fast Sync-N-Go for Mobile Devices
SuperSpeed Market overview and Industry timeline updates. Update on SuperSpeed USB (USB 3.0) specification architecture details. Guidance on industry opportunities for 2008/2009
Intel Architecture Based SoC (System-on-Chip)
Join us to hear about the vision for Intel Architecture-based SoCs and the unique benefits that they bring to the industry. This Technology Insight will focus on a generic SoC on-die architecture and its impact on SoC-based platforms for embedded communications, mobile devices, and consumer electronics. The talk will also outline Intel's expectations of the industry ecosystem in the areas of Electronic System Level (ESL) language, tools, and new methodologies.
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