SanDisk said Monday that it is shipping memory chips that will allow consumers to store more data on tiny Secure Digital flash cards.
SanDisk X4 chip
(Credit: SanDisk)The Milpitas, Calif., company's X4 technology packs four bits of data into each memory cell. To date, flash memory chipmakers typically stored one bit or two bits per cell. Each individual die--or chip--holds 64 gigabits of data, or 8 gigabytes. This is the highest capacity per die in the industry, according to SanDisk.
The technology is not yet shipping in cutting-edge retail products, however: it is currently being used in 8GB and 16GB SDHC (Secure Digital High Capacity) cards as well as 8GB and 16GB Memory Stick PRO Duo cards, the company said.
Future related technology from SanDisk--possibly not based on current X4--is expected to yield SD flash cards that hold 64GB of data and larger capacities. Currently, mainstream SanDisk SD cards top out at 32GB.
Flash memory cards sold at retailers are typically not as reliable as solid-state drives--which also use flash chips--sold with laptops. And the higher the density per chip and the more bits per cell, the bigger the challenge for maintaining data reliability. SanDisk says it has met this challenge.
"Our challenge with X4 technology was to not only deliver the lower costs inherent to 4-bits-per-cell but to do so while meeting the reliability and performance requirements of industry standard cards," Sanjay Mehrotra, SanDisk's president and chief operating officer, said in a statement.
But X4 will, for the time being, be hampered by poorer performance and endurance than X3 (3-bits-per-cell) technology, said Gregory Wong, founder and principal analyst at Forward Insights, which does research on flash memory technology.
The memory technology itself--the 4 bits per cell 64-gigabit memory--is codeveloped and co-owned by SanDisk and Toshiba. The X4 controller technology is solely owned by SanDisk.
Memory chip makers will offer more sophisticated flash drives for smartphones--technology that will be comparable to the solid-state drives found in laptops today.
The Palm Pre comes with an 8GB flash memory drive: flash drive makers like Micron Technology will market more sophisticated flash drives for future phones.
(Credit: Palm)Today's flash drives, which typically range up to 32GB in capacity in products like Apple's iPhone, often use relatively unsophisticated techniques for reading and writing data. In general, the technology is not very different from that used in basic cell phones or digital cameras, according to Brian Shirley, vice president of Micron's memory group.
But as smartphones--and possible future tablet devices--become more like personal computing devices and less like basic MP3 players, memory chip makers will begin offering more sophisticated flash memory, said Shirley, in a phone interview.
"In nearly all MP3 players today it's almost exclusively 'raw' NAND. And at some point we anticipate moving more to a managed NAND," Shirley said. NAND is the type of flash memory chip used in all flash cards and solid-state drives.
Managed NAND falls somewhere between very basic flash drives--such as Secure Digital, or SD, cards--and pricey solid-state drives (SSDs) used in laptops and servers. "It's something in between the raw NAND that we've been talking about for cell phones and MP3 players and the full-blown SSD space," Shirley said.
"We believe this will be fairly busy (market) space in 2010," he added.
Solid-state drives used in laptops like the Apple MacBook Air and Dell Adamo get their performance from highly-developed, sophisticated controller chips and firmware, which manage how the data is read and recorded. Though managed NAND wouldn't necessarily reach this level of sophistication, it would begin to approach it.
The iPhone uses raw NAND with a separate controller, according to Gregory Wong, founder and principal analyst at Forward Insights, which does research on flash memory technology.
"They like to have control over the flash and the controller so they can boost performance," he said. "They're very cognizant of differentiating their products. The user experience is what is important to them. Whether it means you can download your music or video very quickly, whether it means you can find the data very quickly--that ties in to how they manage the NAND," he said.
But even Apple is looking for better performance as it looks to continue its very successful strategy of making its products different, according to Wong.
And future Netbooks may also use this kind of flash memory. Netbooks today using Intel Atom processors and the Windows operating system use, almost exclusively, hard disk drives. But a new category of Netbooks dubbed smartbooks--devices that are always on, always connected, and boast all-day battery life--are expected to come to market in 2010 packing flash drives. These small laptops may be candidates for managed NAND.
Rambus has asked the International Trade Commission to terminate an investigation of Nvidia relating to four patents as part of a November 2008 complaint.
Rambus provides high-speed memory interface technology, though in recent years the company has become better-known for intellectual property litigation practices. Rambus has sued many of the world's largest chip manufacturers.
Nvidia's David Shannon
(Credit: Nvidia)The Los Altos, Calif.-based company conceded before the ITC that Nvidia products do not infringe on its four patents, and also asked for termination of several claims from a fifth patent in the ITC action, according to an Nvidia statement.
"We are pleased Rambus has recognized the weakness of these patents and claims," said David Shannon, Nvidia executive vice president and general counsel in a statement. "These withdrawals represent essentially half of the patents and one third of the claims asserted against us, and we look forward to addressing the remainder of the case."
The current ITC litigation originally included nine patents involving memory controllers related to graphics processors.
In June, Nvidia announced that the U.S. Patent and Trademark Office had rejected 41 claims, in seven patents, which Rambus had asserted in the ITC action against NVIDIA.
Rambus has a checkered track record on lawsuits. The European Commission launched antitrust investigations against Rambus in 2007, alleging intentional deceptive conduct in the context of the standard-setting process, citing its behavior as "patent ambush."
In January, a Delaware federal judge ruled that Rambus could not enforce patents against Micron Technology. Judge Sue L. Robinson, in the U.S. District Court in Delaware, ruled on January 9 that evidence "spoliation" occurred when Rambus allegedly destroyed important information related to the case that could be used against it. Robinson's decision rendered Rambus' patents unenforceable.
Intel appears ready to take another crack at flash memory-based acceleration--this time offering it with future chipsets.
Intel Braidwood technology is based on a flash memory module.
(Credit: Intel)"Braidwood is a flash memory technology that provides faster boot-up time, faster application launch, and a snappier, more responsive system," said Rob Crooke, vice president and general manager of Intel's Business Client Group, speaking during a presentation streamed over the Web from the Computex conference in Taipei, Taiwan, earlier this week.
Braidwood will be offered with the future "5 Series" chipset family--which is Intel's first single-chip chipset--and the future "Clarkdale" processor (see discussion below).
The architecture accelerates I/O (input/output) accesses by saving that data to flash memory, according to Crooke. In a demonstration at Computex, Crooke showed Braidwood "caching the I/O...And then, when it launches that application again, it happens very quickly," he said.
Intel's first stab at technology analogous to Braidwood came in 2006. That product was code-named Robson and eventually branded as Turbo Memory. But it only received lukewarm reviews and was never adopted widely.
"Clarkdale," a Nehalem-based processor, will be offered with Braidwood, according to Intel documentation released at Computex. Clarkdale will integrate graphics silicon into the same package as the main processor. It is on track to begin production in the fourth quarter of this year--with systems available in 2010--and is built on Intel's second-generation 32-nanometer process technology. Clarkdale will be offered with the Intel 5 Series chipset.
On another front, Crooke also talked about the mainstreaming of Intel's Nehalem Core i7 desktop chips, which are currently limited to high-end enthusiast systems. Due later this year, the "Lynnfield" processor is a new four-core, eight-thread processor that will be paired with the P55 Express chipset. Threads essentially double the number of tasks a processor can perform.
Users can expect 40 percent better performance on widely used SPECint benchmarks with the Lynnfield-based platform, compared with last year's mainstream Core Q9650 processor-based technology, Crooke said.
Micron Technology is entering the graphics memory business, going up against heavyweights Samsung and Hynix.
Micron is targeting its memory at the upper mid-range of the graphics chip market
(Credit: Nvidia)Micron, which recently vaulted to the No. 3 spot in global sales of dynamic random-access memory (DRAM), is now aiming at the market for DRAM chips used with graphics processors from Nvidia and Advanced Micro Devices' ATI graphics unit.
The market for DRAM used with graphics processors is about 4 percent of the bits shipped into the DRAM market, according to Micron. DRAM is typically used as the main memory in PCs. This type of DRAM is also referred to as Synchronous DRAM, or SDRAM.
"Our upcoming 50-nanometer technology is very competitive when it comes to power consumption and performance," Robert Feurle, Micron's VP of DRAM marketing, said in a phone interview Thursday.
"I think it's a good point in time to begin discussions with big enablers Nvidia and AMD and get started with some design-ins," Feurle said.
Micron is making its debut with Double Date Rate 3 (DDR3) memory. This is the same type of memory used for the main memory of currently shipping PCs, which have gravitated from DDR2. In the future, Micron will look at making more proprietary graphics memory, referred to as GDDR3 and GDDR5. "No decision has been made yet but we're looking into that very seriously," Feurle said.
Initially, Micron is targeting the "upper mid-range" of the graphics processor market.
Micron says its DDR3 has a distinct power consumption advantage over GDDR3: standard DDR3 can go down to 1.35 volts. "GDDR3 is still running a 1.8 volts. We have a giant power savings advantage," he said.
Micron is targeting memory with speeds of 1600MHz "to get started with and going up from there," Feurle said.
The DRAM market overall has seen sliding sales, falling 20 percent in the first quarter from the fourth quarter and 44 percent from the year-earlier period, according to iSuppli. The problem is overcapacity, which has most notably brought Taiwan memory makers to their knees. In that country, some manufacturers have faced possible bankruptcy.
"Micron now has renewed its competitive vigor, mainly due to its acquisition of a 300mm fab from Inotera in Taiwan," iSuppli said recently. Fab refers to fabrication facility or factory.
Taiwan's economic affairs minister has retreated from previous statements that suggested a merger of the country's ailing memory chipmakers was likely, saying it's "too complicated," according to reports.
Instead, Taiwan Memory Co., the new government-backed entity, will focus on acquiring technologies and tapping existing manufacturing plants in Taiwan, according to a Bloomberg report.
Economic affairs minister Yiin Chii-ming and John Hsuan, a former United Microelectronics Corp. executive who was appointed by the state to oversee the formation of Taiwan Memory, are also saying that the scale of the aid plans will be pared back, Bloomberg said. This is a departure from previous statements that suggested a massive consolidation of the six loss-ridden memory chipmakers was likely.
"It is wrong to assume we would take in these companies with all their debts and problems," Bloomberg reported, citing an interview with Chen Chao-yih, head of the economic ministry's industrial development bureau. The six companies have combined debt of about $11 billion.
Taiwan's memory chipmakers lost a combined $12.5 billion in 2007 and 2008, highlighting the dire straits--including bankruptcies, widespread plant closings, and layoffs--that the memory chip industry is in worldwide.
The six companies are: Nanya Technology, Inotera Memories, Powerchip Semiconductor, Rexchip Electronics, ProMOS Technologies, and Winbond Electronics.
Taiwan named a chip industry veteran to head a state-backed company that will merge six memory chipmakers, following pleas from domestic companies desperate for financial aid.
Previous reports had cited an approval for loans, but on Thursday the economic affairs ministry took this a step further and named former United Microelectronics Corp. executive John Hsuan to head a state-backed company, according to Bloomberg. Taiwan's government will hold less than a 50 percent stake.
Taiwan Memory Co. will be established within six months. It has not been decided yet what role Japan's Elpida Memory or U.S.-based Micron Technology would play, according to the report. One of these two memory chipmakers could either collaborate with the merged companies or become part of the new entity.
At stake is Taiwan's dynamic random access memory (DRAM) industry. DRAM is the main memory used in personal computers. While all memory chipmakers have been suffering, Taiwan's DRAM industry has been falling further and further behind market leaders Samsung and Micron and posting big losses.
The Taiwan-based companies are Nanya Technology, Inotera Memories, Powerchip Semiconductor, Rexchip Electronics, ProMOS Technologies, and Winbond Electronics.
The companies posted combined losses $12.5 billion in 2007 and 2008, Bloomberg said.
Memory chipmakers, the hardest-hit of the silicon suppliers, this week faced bankruptcy, layoffs, and bleak prospects.
Micron Technology kicked things off by announcing that it would cut as many as 2,000 jobs. Micron and other memory chip manufacturers are all singing the same sad song: slumping revenues amid a steep downward price spiral.
The largest U.S. maker of memory chips said decreased demand for specialty DRAM products had "created additional challenges" for its Boise, Idaho, manufacturing operations. As a result, Micron said it will phase out 200-millimeter wafer manufacturing operations at the company's Boise facility.
The same day, flash memory chipmaker Spansion, previously a joint venture of Advanced Micro Devices and Fujitsu, announced layoffs totaling approximately 3,000, or 35 percent of the company's total workforce.
Spansion's CEO, John Kispert, said the Sunnyvale, Calif., company has been forced to "bring our costs in line with the current expectations for significantly reduced revenues."
Kispert also mentioned that he is positioning the company for a "restructuring and/or sale." The company expects the reduction in workforce to provide it with annual cash cost savings of approximately $225 million.
But this wasn't the worst of it. Qimonda, an affiliate of Germany-based Infineon Technologies, said on the same day that it was seeking bankruptcy protection under Chapter 11 for its U.S. unit. In January, Qimonda filed for insolvency protection in Germany after it was not able to secure government financing.
Intel topped off the bad news on Wednesday by disclosing that it was considering getting out of the flash memory-manufacturing business. Intel CEO Paul Otellini made this statement at a Goldman Sachs investor's conference: "It may not be essential for us to have our own NAND factories to build (flash memory). We could probably specify the product that we want and buy it from third parties," he said.
Is there any upside to all this bad news? Maybe.
"A lot of the end-market conditions for all electronics are awful, but we know all this already, and to a certain extent, that is looking backward," said Avi Cohen, managing partner of Avian Securities, which tracks the memory chip market. "Several component (suppliers) and semi(conductor) guys have echoed the fact that February is not getting worse, which is a nice improvement."
Micron Technology is cutting as many as 2,000 more jobs because of slumping demand for its products, as the shakeout in the memory chip business continues.
The largest U.S. maker of memory chips said Monday afternoon that decreased demand for specialty DRAM products has "created additional challenges" for its Boise, Idaho, manufacturing operations. As a result, Micron said it will phase out 200 millimeter (mm) wafer manufacturing operations at the company's Boise facility.
"This action will reduce employment at Micron's Idaho sites by approximately 500 employees in the near term and as many as 2,000 positions by the end of the company's fiscal year," the company said in a statement. Its fiscal year ends in August. Micron added that it has sufficient manufacturing capacity remaining and "does not expect any disruption in product supply required for customer needs."
These job cuts are on top of the workforce reduction announced in October in its flash memory chip operations, the company said. "These workforce changes were not anticipated or included in Micron's earlier 15 percent global workforce reduction announcement last October."
This news follows quickly on the heels of an announcement by German memory chipmaker Qimonda, which said earlier Monday that its U.S. operations would seek Chapter 11 bankruptcy protection.
Micron said that market conditions are not improving for memory products. "We remained hopeful that the demand for these products would stabilize in the marketplace and start to improve as we moved into the spring. Unfortunately, a better environment has not materialized," said Steve Appleton, Micron chairman and CEO, in a statement.
The company will continue to operate its 300mm research and development fabrication facility at the Boise site and perform a variety of other activities.
Cash restructuring charges will be approximately $50 million, which will generate a gross annualized operating cash benefit of $150 million, the company said. The net operating cash flow effect will be neutral for fiscal year 2009.
In the fiscal first quarter ended December 4, Micron posted a net loss of $706 million.
The memory chip industry overall has been caught in a particularly brutal downward price spiral that is hurting even the largest players, including companies like Samsung and Hynix.
SanDisk is disclosing at a San Francisco technology conference Tuesday that it will begin mass production of memory chips that will allow consumers to store up to 64GB of data on tiny flash cards.
SanDisk X4 memory chip packs in four bits per cell
(Credit: SanDisk)The Milpitas, Calif., company's X4 technology will pack four bits of data into each memory cell. To date, flash memory chipmakers typically stored one bit or two bits per cell.
SanDisk--the largest supplier of retail flash cards--is making the disclosure jointly with Toshiba at the 2009 International Solid State Circuits Conference (ISSCC). The two companies will use 43-nanometer manufacturing process technology to make the chips.
X4 technology, which SanDisk got when it purchased M-Systems in 2006, will yield tiny Secure Digital (SD) flash cards that hold 64GB of data. Currently, mainstream SanDisk SD cards top out at 16GB, though pricey 32GB cards are also on the market.
"It is a 64-gigabit single die (chip), which is 8GB (per die), the highest capacity point in the industry," said Khandker Quader, senior vice president, memory technology & product development, SanDisk, in a phone interview Monday.
In addition to the memory chip, the die also includes an X4 controller--which manages the data flow. The memory and controller "will be sold as an integrated solution," Quader said. Controllers are the secret sauce used by flash card and solid-state drive suppliers to boost performance. The importance of controllers increases as flash chip densities increase because higher densities require increasingly sophisticated controllers to deliver the necessary performance.
The memory technology itself--the 4 bits per cell 64-gigabit memory--is co-developed and co-owned by SanDisk and Toshiba. The X4 controller technology is solely owned by SanDisk, Quader said. SanDisk and Toshiba also have joint manufacturing facilities in Japan.
The advancement is important because NAND flash--like all silicon chasing Moore's Law--is facing challenges to increase densities "even at two bits and three bits per cell," he said. (NAND is the type of memory used in flash cards and solid-state drives.)
A SanDisk paper at the ISSCC will discuss the performance of the X4 technology. Data speeds will hit 7.8 megabytes per second, Quader said. "This is comparable to what others are producing at lower bits per cell," he said.
X4 flash cards will be available commercially in the first half of 2009, according to Quader.
SanDisk will also present a paper on 32-nanometer X3 technology--three bits per cell--for use in thumbnail-size microSD cards (even smaller than SD cards) that boast capacities up to 16GB. X3 will also be used in solid-state drives, SanDisk said.
Despite these advancements, SanDisk is still a laggard in the emerging solid-state drive market, where companies like Samsung, Toshiba, Micron Technology, and Intel are the early leaders. SanDisk announced at CES in January that it would deliver a 240GB SSD by mid-year.




