Intel is expressing Moore's Law anew as packing key technologies into fewer chips. New "Clarksfield," "Arrandale" and "Jasper Forest" processors, among others, will showcase this theme later this month at the Intel Developer Forum.
Intel Vice President Steve Smith discussed the highlights of the annual marquee Intel event that will kick off September 22 in San Francisco in a phone interview on Friday.
"Contrary to speculation that Moore's Law is slowing down or potentially dying, we're here to demonstrate that it's alive and well," Smith said. "Integration gives you a smaller, better, faster, more mobile compute platform," he said. Moore's Law, named after Intel co-founder Gordon Moore, states that the number of transistors that can be placed on an integrated circuit doubles roughly every two years.
This theme will be manifested in a number of new processors including the first mobile processor based on Intel's new Nehalem microarchitecture codenamed Clarksfield and even more highly integrated processors to follow dubbed Arrandale and Clarkdale as Intel moves to its next-generation 32-nanometer manufacturing process.
True to its rich heritage of codenames, IDF can, at times, slide into little more than a series of codename-riddled Power Point slides, with some names sounding frustratingly familiar such as Clarksfield and Clarkdale. But codenames, for better or worse, are part and parcel of IDF.
Intel codename decoder:
- Clarksfield: 45-nanometer Nehalem mobile processor integrating I/O
- Clarkdale: 32-nanometer Nehalem desktop chip integrating graphics with CPU
- Arrandale: 32-nanometer Nehalem mobile chip integrating graphics with CPU
- Moorestown: 32-nanometer system-on-chip Atom for smartphones
- Sodaville: 32-nanometer system-on-chip Atom for consumer
- Pine Trail: new Atom for Netbooks integrating graphics with CPU
- Jasper Forest: 45-nanometer, first Nehalem embedded chip for uses such as storage hardware
- Larrabee: Intel discrete graphics chip that will compete with Nvidia, AMD
- Westmere: 32-nanometer manufacturing process technology
Smith said that Intel's move to the next-generation "Westmere" 32-nanometer manufacturing process will drive even more integration next year. "We have completed development and certification of the 32-nanometer process, which means our factory is fully qualified to run the wafers. And we are actually running Westmere CPU wafers through the factory in support of our Q4 revenue production. Absolutely on track for that Q4 revenue production," he said, referring to commercial production of 32-nanometer processors.
In the more immediate future, Intel will roll out a new mobile processor based on its current 45-nanometer technology. "We just announced Lynnfield (the Core i5 and i7 chips for desktops), Clarksfield is the equivalent product for notebooks," Smith said. "Quad-core, 45-nanometer. Based on Nehalem technology but optimized with power management and integration of the PCI express I/O. Moving from a three-chip solution in the original Nehalem products to two chips--and that is our path going forward." I/O, or input-output, is silicon that enables a processor to talk, and shuttle data, to other parts of the system and peripheral components.
Speaking more specifically about Clarksfield integration, Smith said that "the key elements are integration of memory controller, integration of PCI Express 'gen' 2, power management." Intel will also be talking a lot about a feature called Turbo mode. "Turbo mode is extremely important. If you're not using all the cores, the cores that are not used are powered down. The cores that you are using can run at a faster clock rate with Turbo mode," Smith said.
Smith spoke about the next-generation Atom processor for Netbooks and Nettops, "Pine Trail," too. This chip will also ... Read more
Production isn't the only thing being scaled back at Intel because of the world economy. The world's largest chipmaker will cancel its developer conference in Taiwan this year and scale back the one in Beijing.
The Intel Developer Forum in Taiwan typically takes place in October, while China IDF is in April. The IDF in the United States in September will not be affected, Intel said Monday. The Beijing IDF will be shortened to a one-day event. It is typically two days.
Intel uses the IDF to launch many of its products and technologies.
"It's the economy," said David Dickstein, an Intel spokesman. "The reaction we've gotten from exhibitors and sponsors when we told them about the scale-back in Beijing and cancellation of Taiwan, actually was overwhelmingly positive. They're saying it helps with their bottom line."
Attendance will fall dramatically in Beijing. "Before we would bring more than 100 international press to the event. But now the event is really geared toward the local community. We're looking at under 1,000 attendees instead of 5,000 plus," he said. Dickstein said he is working on ways to bring Beijing IDF to the world. "We're looking at a virtual conference," he said.
Both forums are slated to resume again in 2010, he said. So, this is a one-time action.
This was reported earlier at DigiTimes.
There's life beyond WiMax. At the Intel Developer Forum in Taipei Intel is looking beyond that wireless technology to other communications methods for its upcoming Moorestown smartphone platform.
Intel senior vice president Anand Chandrasekher, speaking Monday at IDF, said that Intel will collaborate with Ericsson for High Speed Packet Access (HSPA) data modules for the Moorestown platform. WiMax is also supported, but it faces stiff competition from entrenched wireless technologies and may not be compelling enough to rise above the fray.
In addition to WiMax and HSPA, other wireless technologies including WiFi, GPS, Bluetooth, and mobile TV will be supported on Moorestown, Intel said.
Moorestown is a system-on-a-chip (SOC) comprised of "Lincroft," which integrates a 45-nanometer processor, graphics, memory controller, and video encode/decode onto a single chip. It also includes an "I/O hub" code-named Langwell that supports connection to wireless, storage, and display components.
Intel was also showing a number of slides that detail its upcoming Nehalem i7 processor and the accompanying X58 chipset. Intel said last week that Nehalem is shipping now and is due to be officially rolled out in November.
The i7 will initially appear as a quad-core processor and feature QuickPath Interconnect--a high-speed chip-to-chip communications technology--and "Turbo Boost," which had been referred to previously as "Turbo Mode." This is essentially a switch that turns off unused processor cores and then uses the remaining active cores more efficiently.
In Taipei, Intel also delineated the differences between Atom-based "Nettop" desktops and more mainstream desktop PCs. Intel is trying to promote Nettops for Web browsing, word processing, e-mail, and "legacy" games. Anything more taxing than these basic applications is not recommended for Nettops.
Intel Core i7 and x58 chipset features.
(Credit: Intel)
Intel Atom-based Nettop desktop.
(Credit: Intel)SAN FRANCISCO--In a speech here Tuesday, Intel Chairman Craig Barrett complained about a lack of R&D investment incentives in the U.S. while showing how low-cost computers and a little innovation can make a difference in the classroom.
Intel chairman Craig Barrett (right) watches as Carnegie Mellon University's Johnny Chung Lee demos a Nintendo-based low-cost whiteboard
(Credit: Brooke Crothers)Barrett lamented that the U.S. is not doing enough to spur R&D compared to the rest of the world. "You've got to have the right environment to invite investment in innovation, to invite investment in development," he said in his keynote address at the Intel Developer Forum. "This is my political statement of the day...There's really only one country where I don't see (this) attitude--this one (the U.S.)."
"We don't focus as hard as we should at incentivizing investment and innovation...the lapse of the R&D tax credit is enough of a political statement today. Where the government refuses to acknowledge that investing in R&D is important to the future competitiveness of the U.S., everyone else (in the world) is recognizing that."
ZDNet video: Intel chairman pursues passions
But not all innovation requires great sums of money. Barrett brought out Carnegie Mellon University's Johnny Chung Lee, who showed how to create a "low-cost multipoint interactive" whiteboard using the Nintendo Wiimote.
"Since the Wiimote can track sources of infrared (IR) light, you can track pens that have an IR LED in the tip. By pointing a Wiimote at a projection screen or LCD display, you can create very low-cost interactive whiteboards or tablet displays. Since the Wiimote can track up to four points, up to four pens can be used. It also works great with rear-projected displays," Chung says in a description on his Web site.
Chung concluded his demonstration by saying that cheap, off-the-shelf technology used creatively can do a lot more than just raw computing power. (Not exactly an Intel mantra.) "To be interesting today, technology has to be the fastest, the best, the brightest, the lightest, but here you can see if you sacrifice a little bit of capability and performance for dramatic savings in cost, you can have a pretty dramatic impact."
When the Intel Developer Forum kicks off Tuesday in San Francisco, the theme of low power will be high on the agenda of topics.
Nehalem can deliver greater performance at the same power consumption level of the Core 2 architecture, Intel says.
(Credit: Intel)The headliner at IDF this year is indisputably the upcoming "Nehalem" Core i7 processor. Though the new microarchitecture is replete with esoteric technologies like QuickPath (for faster chip-to-chip communication) and on-chip memory controllers--things that end users can't readily relate to--better power efficiency is something every consumer gets because it results in better battery life.
"(Nehalem) is pretty subtle because it's a change in microarchitecture. A lot of the changes aren't all that visible to the end user. But one of the most notable (changes) is power saving," said Roger Kay, founder and president of Endpoint Technologies.
This won't become apparent to many consumers, however, until Nehalem mobile processors hit the market, according to Kay. "Nehalem notebooks should have dramatically longer batter life," Kay said. Nehalem mobile chips will not appear until next year.
Overall, Nehalem is better than previous Intel architectures at scaling up performance while keeping a lid on power consumption. So, for example, a Nehalem quad-core desktop processor may deliver better performance at power levels equal to current Core 2 quad processors--so Intel says. Nehalem will have all four cores on one piece of silicon, a first for Intel in the mainstream market.
An Intel IDF blurb that describes the technological highlights of Nehalem also states that chips will have "dramatic new energy efficiency gains when workloads are scaled back." Intel will presumably clarify nebulous statements like this at IDF.
In the more immediate future, Maximum PC recently tested a Nehalem "Bloomfield" desktop system that uses a 2.93GHz processor and an Intel motherboard with an X58 chipset. Both of these are expected to ship in the fourth quarter.
Atom is next on the short list of high-profile topics--and Atom is all about power efficiency, not high performance. The tiny mobile chip has a power envelope not exceeding 2.5 watts, far below the 35-watt power envelope of mainstream Intel mobile processors to date.
Though Anand Chandrasekher, general manager of Intel's Ultra Mobility Group, will talk about Atom in handheld mobile Internet devices and discuss Moorestown, the next iteration of Atom, the netbook category is the driving force behind Atom right now. David (Dadi) Perlmutter, general manager of Intel's Mobility Group, will talk about the low-cost mobile market and show off a variety of netbooks, according to Intel.
Current high-profile netbooks include the Asus Eee PC and Acer Aspire.
Since netbooks are synonymous with low power don't expect dual-core Atom processors from Intel designed specifically for netbooks anytime soon, according to Bill Calder, an Intel spokesperson. "There's no reason to do dual core in the netbook. Single-core Atom is perfectly adequate," Calder said. (Dual-core Atom chips for "nettop" desktops are coming by the end of the year.)
"These things are intended for basic Internet use. Mostly reading, sharing, viewing. Not creating, building, burning," Calder said.
Intel will also mention more about it's ultra-low-voltage (ULV) mobile processors. These are essentially Core 2 mobile processors designed for the stringent power requirements of ultralight notebooks like the MacBook Air, Lenovo X300, and the just-introduced Dell 12-inch Latitude E4200.
The current ultra-low-voltage lineup will be refreshed in September with 45-nanometer parts. All LV and ULV processors being sold now are based on older 65-nanometer technology.
Dual-core processors in this category have thermal envelopes as low as 10 watts, though more mainstream low-power processors (like those in the MacBook Air) will fall somewhere between 10 and 25 watts.
Many of these sub-one-inch-thick notebooks will also offer 80GB and 128GB solid state drive options. Micron Technology has introduced solid state drives in 128GB and 256GB sizes. Large-capacity SSDs will be part and parcel of ultralight notebook offerings in the coming months.
At the high end of power spectrum, Intel will also talk more about its first quad-core mobile processor. Both Hewlett-Packard and Lenovo are already showing off quad-core laptops and HP lists the quad-core mobile chip as an option on its EliteBook 8730w mobile workstation. The quad-core mobile processor is also expected to appear in gaming laptops from Dell's Alienware unit.
Intel senior VP Anand Chandrasekher touts Linux for MIDs.
(Credit: Intel)At the Intel Developer Forum in Shanghai this week, the buzz was about the Atom processor, mobile Internet devices, and Linux. What wasn't buzzing? Microsoft.
Welcome to the brave new world of computing sans Redmond.
At IDF, there was little media focus on Intel's next-generation Nehalem chip and even less on the Centrino 2 processor--both of which will run Microsoft software.
The focus was on devices that won't necessarily or exclusively run Microsoft software: Handheld-size MIDs--shorthand for mobile Internet devices--and Netbooks. Netbooks will run both Microsoft Windows and the Linux operating systems, but the MID category appears to be shaping up as a non-Microsoft enclave. MID makers, who are expected to begin shipping devices later this quarter, include Lenovo, Toshiba, Panasonic, and LG Electronics.
Asianux distributes Mobile Midinux.
(Credit: Intel)Anand Chandrasekher, Intel senior vice president and general manager of the Ultra Mobility Group, said in his IDF keynote: "As always, we partner with Microsoft." Then he proceeded to not mention Microsoft again--and mentioned Linux a lot. "We announced an initiative last year. A Linux-based initiative. In order to get the form factor down, to get the cost down, and to even get lower power levels beyond what was achievable. We have an entire ecosystem behind it. Ubuntu and Red Flag. The initiative is called Moblin," Chandrasekher said.
Aptly enough, the Moblin Web site is entitled: "mobile and internet linux project." That's pretty self-descriptive.
Whether MIDs succeed or not, only time will tell. But if they do succeed, it won't be on Microsoft Windows--at least not in the foreseeable future. Microsoft has recently hired Len Kawell, originally the CEO at Pepper Computer, a start-up focused on MID software, to scale Windows from smartphones (some of which run Windows Mobile) to MID-type devices with "larger screens and faster processors," according to a representative at Weber Shandwick, the P.R. firm that represents Microsoft's Mobile business.
Scott Rockfeld, Group Product Manager for Microsoft's Mobile Communications Business, said this in an e-mail Thursday: "Windows Mobile is constantly innovating the platform to meet the expanding mobile needs of our customers. MIDs are an exciting class of devices that address many of those needs, and we're focused on ensuring that Windows Mobile is a great platform for partners to build MIDs."
But that's probably news to a lot of the attendees in Shanghai listening to Renee James, vice president general manager of the Software and Solutions Group at Intel.
"This new category requires a new software environment. There isn't a built-in ecosystem of developers who have been doing MIDs," she said, describing the incipient market. "For MIDS, we, Intel, are establishing that ecosystem. We launched it in September. It's called Moblin.org. It's an open-source project. Intel has contributed the foundational stack. More than 500 member companies are contributing code into Moblin. And it's particularly strong in Asia."
If MIDs catch on--and that's still a big if (though Apple's popular iPhone is arguably a MID)--it will be refreshing to see a PC platform develop without Microsoft participation, or at least see a platform unfold in which Linux distributors may have an advantage over the software giant.
An Intel executive demonstrated upcoming solid-state drives at this week's Intel Developer Forum in Shanghai, noting that the chipmaker is on track to deliver the drives later this year.
Meanwhile, an Intel fellow describes his "addiction" to solid-state drives in a blog posted Wednesday.
Intel solid-state drives
(Credit: Intel)Knut Grimsrud, an Intel fellow who leads an R&D group responsible for developing new mainstream storage innovations, described in a blog the difference between using a hard drive and a solid-state drive.
"I played the part of Guinea Pig and had one of our pre-production solid-state drives installed in my IT laptop...I was unprepared for the powerful instant high it gave my system," he said in his blog. There was a "dramatic difference in how my system responded," he noted.
"Then the day came that my SSD was retrieved for data mining...and my original hard-disk was put back into my laptop. There's no way to feel the pain quite as intensely as having to go back."
(Note: I can second Grimsrud's statements. I own a SSD MacBook Air. Once you use an SSD and realize that there is a world without hard drive bottlenecks, a hard-drive-based system seems very old.)
Intel is expected to make an announcement about SSDs in the second quarter.
Features of upcoming Intel solid-state drives
(Credit: Intel)David Perlmutter, executive vice president/general manager of the mobility group, commented at IDF Shanghai on the input/output, or I/O, issues related to hard drives.
"CPUs, graphics, and media chips have improved significantly year after year, but I/O remained very limited in performance," Perlmutter, said. I/O refers to the data transfer speed of the hard drive. Even with the fastest processor in the world, he said, an I/O bottleneck can put a crimp on performance.
Intel currently offers small-capacity chip-level (what are called Thin Small Outline Packages or TSOPs) technology that provides end-product sizes ranging up to 16GB. But this modest line of products will get a big boost in the second quarter when Intel offers 1.8- and 2.5-inch SSDs ranging from 80GB to 160GB in capacity. Intel's SSDs will compete with Samsung, for example, which is slated to bring out a 128GB SSD in the third quarter.
Intel showed what it considers the smallest PC motherboard in the world at the Intel Developers Forum (IDF) in Shanghai. The motherboard, or main PC circuit board, will go into the company's next-generation "Moorestown" mobile Internet device (MID) platform due in the 2009-2010 time frame.
Intel's Anand Chandrasekher holding motherboard
(Credit: Intel Corp.)"Our engineers have been very hard at work on Moorestown," Anand Chandrasekher, senior vice president and general manager of Intel's Ultra Mobility Group, said during an IDF keynote speech Wednesday. "The platform design teams have been hard at work in figuring out what is the smallest form factor that they can actually fit a complete PC motherboard into so they can deliver a great mobile Internet experience."
"What I'm holding in my hand is what is possibly the world's smallest PC motherboard," Chandrasekher said. The Moorestown motherboard houses the processor, chipset (including graphics), and memory, along with silicon for 3G, Wi-Fi, Bluetooth, and GPS, he said. "This is the heart of the new machine."
Moorestown will be Intel's showcase system-on-a-chip, combining the CPU, graphics, and memory controller (and other silicon mentioned above) on a single die. It will likely be the main launching pad for Intel into the mobile phone market--what the chipmaker calls "MID phones." Moorestown may also be a major market for Intel's upcoming solid-state drives.
Intel Moorestown platform
(Credit: Intel Corp.)While the marquee processor theme at IDF Shanghai is "milliwatts to petaflops," Intel is also set to offer a vision of universal connectivity.
The main theme for the event, which starts Wednesday, Beijing time, refers to "very, very big to very, very small and low power," according to Pat Gelsinger, senior vice president and co-general manager of Intel's digital enterprise group, speaking in a video.
(See: Intel rolls out five new Atom processors.)
"Milliwatts" refers to chips such as Atom, a tiny low-power, low-cost processor destined for ultramobile devices and low-cost desktops typically running either Linux or Windows XP. The first Atom chips will launch in June.
"Petaflops" refers to high-performance computing--what used to be called supercomputing. ("Peta" is quadrillion, or a thousand trillion; "flop" is floating-point operation.) Intel is targeting petaflop supercomputers that would compete with the fastest supercomputer in the world: IBM's Blue Gene/P machines.
Though more technology and product details will certainly emerge in the next two days in Shanghai, the main chip themes are already out there. Gelsinger spelled them out at briefing earlier this month.
The specs for Intel's Dunnington processor
(Credit: Intel)The chip buzzwords are: Tukwila, a new quad-core chip with 2 billion transistors, a whopping 30MB of cache, and a new interconnect technology called QuickPath; Dunnington, a six-core chip for multiprocessor computers that can support four or more processors (in this case, each with six cores); Nehalem, a follow-on to the current "Penryn" processors, it is a new 45-nanometer chip microarchitecture due in the fourth quarter that scales up to eight cores; and Larrabee, a visual-computing architecture that uses many cores ("many" usually means many more than a typical quad-core computer).
In addition to Atom, the processor spotlight will likely fall on Nehalem and Larrabee. Nehalem is a relatively known quantity; Larrabee, a relatively unknown quantity. So interest should focus on the latter.
Nehalem boasts increased parallelism, better branch prediction (to move instructions more quickly through the instruction pipeline), and an on-chip memory controller for increased memory performance--what Intel calls "memory latency reduction." Something, by the way, Advanced Micro Devices already has in its chips.
Larrabee is a graphics processor scheduled for the 2009-2010 time frame. It will include a new vector instruction set to improve the performance of graphics and video applications. Larrabee will be compatible with Intel's popular x86 instruction set, theoretically making life easier for software developers.
On another front, Intel is evangelizing universal connectivity, always a problematic proposition, simply because it invariably promises more (sometimes much more) than it can deliver. Intel puts it this way: "Imagine a day when a single device small enough to fit in your pocket...knows your tendencies and preferences and can adapt and optimize its interfaces to match what you are doing at any point any time...Imagine a day when this device...can dynamically become a hybrid combination of other computing and multimedia devices in close proximity." You get the picture. Intel calls this "Carry Small, Live Large."
On a slightly more practical level, the Cliffside technology is being demonstrated from the Mobile Products Group; it enables a single Wi-Fi adapter to function like two independent Wi-Fi adapters. The hope is that this technology could sync your MP3 and video files without a USB cable, directly and wirelessly connecting your notebook to your TV to view HD movies. More here.
There is also a demonstration of wireless device discovery and setup. This demonstration shows how to detect and connect to nearby wireless displays, using the familiar FnF7 (Function F7 key combination).
The following is a partial list of the sessions at this week's Intel Developer Forum in China, which runs April 2 to 3. Topics set to be covered at IDF Shanghai include Netbook, Nettop, Bloomfield (Nehalem), solid-state drives, QuickAssist (accelerators), system-on-chip (Tolapai), and USB 3.0.
The items below are taken directly from Intel's own material:
Intel Atom Processor for the Desktop
The Essential Building Block for Purpose Built, Basic Desktop Computing Devices: Intel's strategy for basic desktop computing devices. See how the new Intel Atom processor based desktop platforms provide the world's best solution for basic computing, content consumption, and thin client.
Intel Basic Mobile Platform with Intel Atom Processor: Growing New Markets
Overview of growth opportunities for internet-centric computing devices or netbook market. Introduction to 2008 Basic Mobile Platform with Intel Atom Processor Architecture. Understand low cost system BOM (Bill Of Materials) & implications for netbooks. How netbooks are different from Mobile Internet devices, Ultra Mobile PCs, and Entry Notebooks. Opportunities for OEMs/ODM/Software community.
The Intel-Powered Classmate PC: Innovating for the Future
An introduction to technology for the next billion users and how to designing a product for first time user in environments that are not ideal. This includes the implementation of specific technical features in the Second and Next Generation Intel-powered classmate PC including: - PATA MLC Flash - Rugged and high temperature tolerant parts/design - Fan-less thermal system design.
Passive and Fanless Thermal Enabling for Affordable Internet-Centric Nettop
Introduction of Nettop, internet-centric computing devices roadmap and associated thermal solution space. Value proposition of passive/fanless cooling - Cost, Noise, new usage.
High End Desktop Platform, Next Generation (Nehalem) Processor
Background on the Desktop version of our Next Generation Intel Microarchitecture (Nehalem) Processor. Key electrical and system design guidelines to consider in designing a platform with the new Intel desktop processor (Bloomfield). Information on the new Quick Path Interconnect (QPI) & the Integrated Bus Controller on the new Intel desktop processor (Bloomfield) processor. Updates on other key new technologies of this High End Desktop platform and the advantages they bring to developers
Microsoft Windows Rally Technologies
The Windows Rally technologies provide manufacturers of network-connected devices with an architecture that enables effortless setup, more secure and manageable connectivity to other devices and computers, and rich end-user experiences. Using Windows Rally technologies enables hardware and software developers to focus development resources on product differentiation rather than connectivity fundamentals. For our mutual consumers, the result will be a dramatic reduction in complexity. Connecting a network device to a PC will be effortless, reliable, and more secure.
SATA Solid-State Drives: Not All Drives are Created Equal
A technical overview of NAND-based high-performance SATA solid-state drive (SSD) technology. A comparative review between Intel's upcoming SATA SSD products and other SSD and conventional hard disk drive alternatives, focusing on the areas of performance, power and reliability
DDR3, the Optimal Memory for Notebooks
Understand the benefits of DDR3 memory. Understand the DDR3 eco-system readiness and outlook for Mobile. Learn how memory impacts critical performance and power benchmarks and what these benchmarks mean to end-users.
Extreme Mobile Gaming: Design Considerations for High Performance Notebooks
Introduction to Extreme Edition Gaming Notebooks. Details on Extreme Edition Notebook hardware & software offerings. Updates on available Thermal technologies. Methods to tune platform performance
Inside Intel Next Generation Nehalem Microarchitecture
Intel's Nehalem microarchitecture is the next major microarchitecture update from Intel aligning to it's "Tick-Tock" cadence for processors. This session will provide architectural insight into this new microarchitecture that will start shipping in the second half of 2008. You will learn the details behind the key microarchitecture features including: Enhancements to the out of order execution engine. Enhancement to the Platform bandwidth. Enhancements to the cache subsystem. Extension to the instruction set with SSE4.2. And more...
Intel QuickAssist Technology Components
Understanding of the scope of Intel QuickAssist Acceleration Technology and Components. Hardware and software architecture of Intel QuickAssist Technology FSB-FPGA Accelerators and AAL. Learn about the Integrated Accelerator & Intel's new System On Chip Product (Tolapai). Hardware and software architecture framework of Tolapai
Moblin.org - Open Source Development for the Intel Powered Mobile Internet Device
Moblin.org, the umbrella open source project hosts the core software stack and technologies for Intel powered Mobile Internet Device (MID). This course will go into technical details on Moblin.org, for how you could setup platform-specific environment and build applications based on Moblin.org sub-projects and technologies.
SuperSpeed USB - Fast Sync-N-Go for Mobile Devices
SuperSpeed Market overview and Industry timeline updates. Update on SuperSpeed USB (USB 3.0) specification architecture details. Guidance on industry opportunities for 2008/2009
Intel Architecture Based SoC (System-on-Chip)
Join us to hear about the vision for Intel Architecture-based SoCs and the unique benefits that they bring to the industry. This Technology Insight will focus on a generic SoC on-die architecture and its impact on SoC-based platforms for embedded communications, mobile devices, and consumer electronics. The talk will also outline Intel's expectations of the industry ecosystem in the areas of Electronic System Level (ESL) language, tools, and new methodologies.
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