Nanotech - The Circuits Blog

Updated on September 16 at 6:30 a.m. PDT: adding information from Hironori Kasahara, a professor of computer science at Waseda University

Large electronics companies are building a chip for consumer electronics devices in Japan, while a China-based device manufacturer said it is working on devices using the ARM chip design, according to reports.

Waseda University's Hironori Kasahara wrote software for chips that Japanese companies are developing.

(Credit: Waseda Daigaku)

In Japan, some of the country's largest electronics and chip manufacturers are collaborating in an effort to develop a new low-power processor design for consumer electronics devices, according to Nikkei, which Forbes reported earlier.

The Japan-based group includes Fujitsu, Toshiba, Panasonic Renesas Technology, NEC, Hitachi, and Canon. The Ministry of Economy, Trade and Industry will offer between 3 billion and 4 billion yen (between $32 million and $43 million) to support the project, according to Nikkei.

Each company will develop their own central processing unit, or CPU. The report claimed that the chips would be compatible with "energy-saving" software developed by Hironori Kasahara, a professor of computer science at Waseda University, Nikkei said. Kasahara said he was developing an application programming interface (API) for multi-core processors, in response to an e-mail query.

A prototype is able to operate using less than 30 percent of normal power consumption and works even when a power outlet is not available, according to Nikkei.

Once a standard is established--the companies are targeting 2012--the CPU will be used in TVs, digital cameras, and other products. The companies may also sell the chip to other companies for use in automobiles, servers, and robots, Nikkei said.

That doesn't mean, however, the CPU will be adopted across Asia. Following the Nikkei article, Taipei-based Digitimes reported that circuit board makers in Taiwan are not enthusiastic about the prospects of a new CPU architecture.

A more immediate threat to Intel--and possibly a more potent rival to any chip that emerges from the Japan-based chip consortium--is ARM, the power-stingy processor design already used by a host of chip manufacturers including Samsung, Texas Instruments, and Qualcomm.

Hon Hai--also referred to as Foxconn--the world's largest contract electronics manufacturer, is readying small laptop designs based on the ARM processor, according to various reports.

A special assistant to the Hon Hai CEO was quoted by Reuters as saying that the company has "a few smartbook projects" based on the ARM chip. Smartbooks are essentially a smartphone in a larger format, such as a small laptop or tablet. These designs are being promoted by Qualcomm, Nvidia, and Freescale, among other chip manufacturers.

Intel is developing a new version of the Atom processor, a so-called system-on-chip, or SOC, that is slated for use in smartphones as well as consumer electronics products. The smartphone and consumer electronics segments are already highly competitive, unlike the PC market, which is dominated by Intel.

Spansion said Thursday that it is exploring a merger or sale, as the flash memory chip company delays interest payments on notes.

The Sunnyvale, Calif.-based company announced that it has been "exploring strategic alternatives, including, but not limited to, opportunities to merge with or sell to similar U.S. or foreign businesses."

Spansion, one of the largest flash memory suppliers, was formed by the integration of Advanced Micro Devices' and Fujitsu's flash memory operations in 2003. The company has posted a long string of losses as it has struggled to turn a profit in the fickle NOR flash memory business.

NOR flash is used in set-top boxes and cell phones but addresses a much different market than its better-known cousin, NAND flash. NOR is typically used to store and run computer code, while NAND is used for large-capacity storage, just like hard disk drives.

Spansion received a lukewarm response to its IPO in 2005.

The company said Thursday that it has engaged Barclays Capital "to assist the company in exploring these strategic alternatives," the company said.

In connection with this, Spansion has initiated discussions to begin an "organized process of potential balance sheet restructuring opportunities" and will delay making the interest payment on its outstanding 11.25 percent senior notes due 2016, which is due January 15, the company said.

Standard & Poor's Ratings Services on Thursday lowered its corporate credit rating on Spansion to "D" from "CCC" and the issue-level rating on the company's 11.25 percent senior unsecured notes due 2016 to "D" from "CC."

After a string of quarterly losses, Spansion, according to reports, is also considering Chapter 11 protection.

Updated on January 6 at 11:20 a.m. PST with correction about Nano 3000.

Dual-core Intel Atom rivals are in the works.

Via Nano procesor

(Credit: Via Technologies)

Via Technologies is planning a very low-power, dual-core Nano 3000 processor, according to Chinese-language Web site HKEPC.

Via's C7-M processor is used in Hewlett-Packard's 2133 Mini-Note, which preceded the crop of Netbooks based on the Atom CPU. Via processors, however, were subsequently eclipsed by Intel's Atom.

Advanced Micro Devices will target its low-power dual-core "Conesus" at the laptop market segment above Atom's Netbook-centric space.

Meanwhile, Freescale Semiconductor has indicated that it will bring out a very-low-power ARM chip that features a dual-core graphics engine targeted at Netbook-like laptops.

All of these developments indicate that the market for ultra-small devices and laptops should heat up in 2009.

Intel currently offers the dual-core Atom 330 that is targeted at Nettops--small desktop computers.

The dual-core version of the Via Nano--due in late 2009 or 2010--may use a Fujitsu 45-nanometer or TSMC (Taiwan Semiconductor Manufacturing Company) 40-nanometer manufacturing process, according to HKEPC. The Intel Atom is based on 45-nanometer process technology.

(Correction: the Via Nano 3000 will not be dual-core. The dual-core version of Nano will ship in the second half of 2009.)

The Via chip may also include SSE4 instruction support, HKEPC said. Generally, SSE4 (Streaming SIMD Extensions 4) instructions speed up multimedia applications.

Via is also slated to bring out other improved Nano processors in 2009, according to the report.

Fujitsu is in talks to sell its hard disk drive business to Western Digital, according to a Japan-based report.

Western Digital is the second-largest hard disk drive maker in the world behind Seagate Technology. Fujitsu's HDD unit is ranked sixth.

Fujitsu would sell all of its plants--including those in Japan, Thailand, and the Philippines--for between 70 billion yen and 100 billion yen (approximately $660 million to $944 million), according to Japan's Nikkei news service.

This would be one of the largest business unit sell-offs for a Japanese electronics company, Nikkei said, adding that Fujitsu's hard disk drive business has been posting losses.

The deal would be finalized by the end of the year, according to Nikkei.

A Western Digital representative would not comment on the report.

Beyond the brutal price competition that is typical in the hard disk drive industry, there is a clear-and-present threat now from solid-state drives. Until this year relegated to digital camera and music player storage, solid-state drives are now making inroads--albeit small--in laptops, particularly ultraportables like the MacBook Air, Dell's new E4200 line, and Netbooks such as the Asus Eee PC.

Solid-state drive suppliers such Intel, Micron Technology, Samsung, and STEC are also beginning to target SSDs as replacements for hard disk drives in the enterprise.

Update with Dunnington and Core i7 photos, text.

The latest and greatest silicon and derivative products is what the Intel Developer Forum is all about. Moorestown, Tolapai, and Canmore are just a few of the chips detailed at IDF this week, while UrbanMax, new netbooks, and the first laptops based on the quad-core mobile processor were among showcased products.

Intel Chairman Craig Barrett delivers the IDF keynote. Barrett criticized America's K-12 educational system and said great technology still can't take the place of great teachers.

(Credit: Brooke Crothers)

Intel Chairman Barrett brought out Carnegie Mellon University's Johnny Chung Lee, who demonstrated how cheap, off-the-shelf technology--in this case a makeshift whiteboard--can go a long way. "To be interesting today, technology has to be the fastest, the best, the brightest, the lightest, but here you can see if you sacrifice a little bit of capability and performance for dramatic savings in cost, you can have a pretty dramatic impact," Chung said.

One of the more novel devices demonstrated was the 10-inch Intel UrbanMax a computer that can switch between a laptop and tablet. This by itself isn't groundbreaking because tablet PCs from Hewlett-Packard and Toshiba already do this. The novelty is the size and design: it is smaller than an ultraportable--like the Toshiba Portege--yet is designed like an oversize mobile Internet device such as Compal JAX 10. When configured as a tablet, the keyboard is hidden but can morph into a laptop by sliding out the keyboard, which tilts the screen.

Intel UrbanMax concept design has a 10-inch screen and uses special low-power Centrino 2 processors

(Credit: Intel)

Intel UrbanMax in laptop configuration

(Credit: Brooke Crothers)

An Intel official demonstrating the device said that "UrbanMax is an innovation platform from Intel. This is a product-ready concept." UrbanMax uses "Montevina" Centrino 2 small form-factor (SSF) silicon. SSF chip packaging is used in the MacBook Air and results in lower voltage and smaller size than typical Intel low-power mobile processors.

It is interesting to note that major PC makers have adopted Intel concept designs in the past. Last year, Intel offered a ultra-thin laptop concept design that was eventually adopted by HP for its Voodoo Envy 133 notebook.

Sun Microsystems and Fujitsu have announced a quad-core version of the Sparc64 processor and servers to that will use the chip.

Fujitsu--which manufactures and designs the Sparc64 processor--along with Sun unveiled the M4000, M5000, M8000, and M9000 enterprise servers that use the new quad-core Sparc64 VII chip. The two companies claim the processor delivers 80 percent better performance using 44 percent less power than the previous Sparc64 VI processor.

Sun Sparc road map

(Credit: Sun Microsystems)

The Sparc64 VII is made on a more advanced 65-nanometer process than the Sparc64 VI chip, which used a 90nm node.

Sun is no stranger to multicore--putting many processing cores on one chip. Its UltraSparc T2 processor can place up to eight cores on a single piece of silicon. This allows the UltraSparc T2 to run up to 64 threads--parts of a program that can execute independently--or eight threads per core. It's a feat processor giant Intel still hasn't accomplished.

Sparc Enterprise servers using the Sparc64 VII processor are targeted at high-availability, mission-critical enterprise applications, including large-scale databases, data warehousing, and enterprise resource planning.

Current Sparc Enterprise servers can be seamlessly upgraded by swapping out older processors with the new Sparc64 VII chips, the two companies said. Sparc VI and Sparc VII chips can also be mixed and matched within a "single domain."

Pricing and availability information is here.

Fujitsu LOOX U series: small but not svelte.

(Credit: Fujitsu)

Before the Intel Atom processor, there was the A110. This chip spawned the 2007 UMPC (Ultramobile PC) category which in turn spawned some unsightly designs.

The Intel A110 and its lower-performance sibling the A100 were launched in 2007 with the intention of jump-starting the UMPC market. But that market stalled. Intel is still promoting the UMPC as a broad, somewhat amorphous category for business, while pushing the Mobile Internet Device, or MID, for fit-in-your-pocket consumer-centric designs and the Netbook for small, inexpensive, Internet-centric notebook form factors (both of which, as I will discuss below, have a better chance of success).

Kohjinsha SH Series: that's not a docking station, that's the bottom one inch of the computer.

(Credit: Kohjinsha)

Why were first-generation UMPC devices seen at trade shows and on gadget enthusiast blogs but rarely at airports (i.e., people actually using the devices)? Some were simply too expensive (the OQO PC and Samsung Q1 Ultra). Others, like the General Dynamics MR-1 discussed below, had a limited market to begin with. More generally, however, they were also slow and, for their size, disproportionately thick. For anyone considering one of these devices, these last two factors would tip the scale against a purchase.

I will focus on the last point. I submit that the design is inherently flawed. Thickness, no matter how compact, does not translate into mass appeal or even limited appeal. (Tiny keyboards don't help the cause either.)

First up, the 2007 Fujitsu LOOX U series UMPC. This UMPC uses the Intel A110. Yes, beauty is subjective but an ultramobile PC shouldn't be thicker than a brick. Fujitsu, like other UMPC vendors, adheres--doggedly--to the small-but-thick form factor.

Next, the Kohjinsha SH series. It comes with the A110 processor and a TV tuner--thus the 70s-style hinged antenna. Not surprisingly, being so thick (no, the bottom photo is not a docking station, it's the bottom one inch of the computer), it comes with almost everything a standard notebook PC offers, including a 120GB hard disk drive, Ethernet, Bluetooth, media slots, stereo speakers, and Windows Vista Home Premium.

General Dynamics MR-1

(Credit: General Dynamics)

The General Dynamics MR-1 needs some qualification: it uses an Intel Core Solo Ultra Low Voltage (ULV) processor, not an A100 or A110, and it's built specifically as a rugged UMPC for the military. Still, it represents why UMPCs are used in the military and not in civilian life. It's one tough PC but would you buy one of these at Best Buy?

Finally, the OQO PC. This is probably one of the better UMPC-like designs but it's still too thick. It does, however, pack a 1.6-GHz VIA C7M processor, a good low-power alternative to an Intel chip.

I think consumers expect small designs to be slim. Though vendors will argue a design like this is impractical because it precludes crucial features that make it a personal computer, I would submit, again, that the original UMPC concept is flawed. Consumers don't expect to get a full-fledged PC in a tiny form factor. Some businesses may want this for very limited applications but I see little market opportunity beyond this. The MID concept--arguably, the iPhone is a MID--has much more potential because it doesn't try to be all things to all people. The user gets a limited number of features that do a limited number of things pretty well.

OQO PC

(Credit: OQO)

One final thought: The ECS G10IL, though technically a Netbook, is a good example of a riveting design that is both compact and relatively slim. This is what some UMPCs, at the very least, should try to emulate. Asus's Eee PC--also a Netbook--is also more along the lines of what will appeal to consumers and even to businesses. Of course, some high-end mobile phones from Nokia, Motorola, and others may also fall into this category.

ECS's G10IL is a good example of what a compact design should look like

(Credit: Elitegroup Computer Systems)