Nanotech - The Circuits Blog

Updated on September 23 at 12:30 a.m. PDT: adding information about the Atom Developer Program.

SAN FRANCISCO--In his keynote at the Intel Developer Forum on Tuesday, Intel CEO Paul Otellini focused on moving beyond the PC while introducing a new processor technology and a new development platform for the Atom processor.

"We're moving from personal computers to personal computing," Otellini said.

Intel CEO Paul Otellini shows a next, next-generation wafer containing 22-nanometer chips

(Credit: Stephen Shankland, CNET News)

He called this a transition to a continuum. "The same experience on any device. How we build this continuum out. That's the theme," he said. "Moore's Law, platform architecture, and software--the combination of these three will allow us to build the continuum."

Otellini also had a surprise. He introduced the company's next, next-generation technology, based on a 22-nanometer process. Intel currently makes chips based on 45-nanometer technology and will move to 32-nanometer by the fourth quarter of this year. After that comes 22-nanometer chips.

Generally, the smaller the chip's geometry, the faster and more power efficient the chip is.

"The world's first working 22-nanometer silicon technology," Otellini said. He showed a wafer containing SRAM memory chips that each contained 2.9 billion transistors. "This is on track for for second half 2011."

In the more immediate future are the 32-nanometer processors. "Thirty-two-nanometer enables us to build a billion transistors in high volume. Started production on Westmere (the 32-nanometer technology) for shipment to customers in Q4." Otellini demonstrated the upcoming 32-nanometer mobile "Arrandale" processor--which integrates graphics silicon with the main processor--in a laptop.

The Intel CEO also introduced a new Intel developer program for the Atom processor in order to boost software adoption on Netbooks and expand the development of software beyond those devices. Asus, Acer, and Dell are supporting the program, Otellini said.

The program provides a framework for developers to create and sell software applications for netbooks with support for handhelds and smart phones available in the future. "We want to fuel the growth of Intel Atom-based products designed for the mobile lifestyle," said Renee James, corporate vice president and general manager, Intel Software and Services Group, in a statement.

As another example of where Atom will be used, Otellini said that automakers Daimler and BMW will use in-vehicle Atom-based infotainment systems from Harmon International in future vehicles.

Otellini also addressed the European Commission's publication on Monday of antitrust allegations against Intel. "They consistently ignored information," Otellini said. He added that customers such as Dell will come forward to state that some of the information was "wrong." In a statement, Intel said Monday that "the Commission relied heavily on speculation found in e-mails from lower level employees that did not participate in the negotiation of the relevant agreements."

Addressing the PC market, Otellini said that he expects "significant growth in 2010." This year he sees "units flat to slightly up," he said, but next year "I think the market is poised for a resurgence."

Intel is expressing Moore's Law anew as packing key technologies into fewer chips. New "Clarksfield," "Arrandale" and "Jasper Forest" processors, among others, will showcase this theme later this month at the Intel Developer Forum.

Intel Vice President Steve Smith discussed the highlights of the annual marquee Intel event that will kick off September 22 in San Francisco in a phone interview on Friday.

"Contrary to speculation that Moore's Law is slowing down or potentially dying, we're here to demonstrate that it's alive and well," Smith said. "Integration gives you a smaller, better, faster, more mobile compute platform," he said. Moore's Law, named after Intel co-founder Gordon Moore, states that the number of transistors that can be placed on an integrated circuit doubles roughly every two years.

This theme will be manifested in a number of new processors including the first mobile processor based on Intel's new Nehalem microarchitecture codenamed Clarksfield and even more highly integrated processors to follow dubbed Arrandale and Clarkdale as Intel moves to its next-generation 32-nanometer manufacturing process.

True to its rich heritage of codenames, IDF can, at times, slide into little more than a series of codename-riddled Power Point slides, with some names sounding frustratingly familiar such as Clarksfield and Clarkdale. But codenames, for better or worse, are part and parcel of IDF.

Intel codename decoder:

• Clarksfield: 45-nanometer Nehalem mobile processor integrating I/O
  
• Clarkdale: 32-nanometer Nehalem desktop chip integrating graphics with CPU
  
• Arrandale: 32-nanometer Nehalem mobile chip integrating graphics with CPU
  
• Moorestown: 32-nanometer system-on-chip Atom for smartphones
  
• Sodaville: 32-nanometer system-on-chip Atom for consumer
  
• Pine Trail: new Atom for Netbooks integrating graphics with CPU
  
• Jasper Forest: 45-nanometer, first Nehalem embedded chip for uses such as storage hardware
  
• Larrabee: Intel discrete graphics chip that will compete with Nvidia, AMD
  
• Westmere: 32-nanometer manufacturing process technology
  

Smith said that Intel's move to the next-generation "Westmere" 32-nanometer manufacturing process will drive even more integration next year. "We have completed development and certification of the 32-nanometer process, which means our factory is fully qualified to run the wafers. And we are actually running Westmere CPU wafers through the factory in support of our Q4 revenue production. Absolutely on track for that Q4 revenue production," he said, referring to commercial production of 32-nanometer processors.

In the more immediate future, Intel will roll out a new mobile processor based on its current 45-nanometer technology. "We just announced Lynnfield (the Core i5 and i7 chips for desktops), Clarksfield is the equivalent product for notebooks," Smith said. "Quad-core, 45-nanometer. Based on Nehalem technology but optimized with power management and integration of the PCI express I/O. Moving from a three-chip solution in the original Nehalem products to two chips--and that is our path going forward." I/O, or input-output, is silicon that enables a processor to talk, and shuttle data, to other parts of the system and peripheral components.

Speaking more specifically about Clarksfield integration, Smith said that "the key elements are integration of memory controller, integration of PCI Express 'gen' 2, power management." Intel will also be talking a lot about a feature called Turbo mode. "Turbo mode is extremely important. If you're not using all the cores, the cores that are not used are powered down. The cores that you are using can run at a faster clock rate with Turbo mode," Smith said.

Smith spoke about the next-generation Atom processor for Netbooks and Nettops, "Pine Trail," too. This chip will also ... Read more

Updated at 1:30 p.m. PDT: adding information about Core i7, i5, and i3 branding.

Intel's upcoming "Arrandale" will be the first highly integrated chip of its kind from Intel and is expected to run the gamut of laptop designs, from ultrathin to mainstream.

Dell ultrathin Adamo: a category of laptops that will likely use a number of different Arrandale chips

(Credit: Dell)

Due by the fourth quarter, it will be the first Intel product to put two processor cores and a graphics function together in the same chip package. Intel covered the underlying architecture in a presentation at the Hot Chips conference in Palo Alto, Calif., this week and in a recent blog described the design, saying it "will be the basis of all upcoming new Core chips (Core i3, i5, and 7) over the next few months."

Arrandale will come under the Core i3, Core i5, and Core i7 brands, using the chipmaker's most advanced 32-nanometer technology (Intel chips are currently built on a 45-nanometer process) and will populate consumer and business laptops.

The compact chip, however, is not without its challenges. "A high level of integration is always a compromise. There's never a free lunch," said Ashok Kumar, an analyst at investment bank Collins Stewart. "It's a question of how much performance you have to compromise to get that level of integration and low power consumption."

"There won't be a significant jump in performance, but price and power consumption will be lower," said Jon Peddie of president and founder of Jon Peddie Research.

Last month, Japanese-language technology Web site PC Watch published specifications for Arrandale and other upcoming Intel processors that were, PC Watch says, obtained from an OEM (original equipment manufacturer) computer manufacturer. It shows Arrandale coming in mainstream as well as low-voltage and ultra-low-voltage versions. The latter two classes of chips have typically gone into upscale svelte designs such as the Dell Adamo and Apple MacBook Air.

Arrandale-based chips, however, are expected to quickly go downmarket and bring Intel's new Core i "Nehalem" microarchitecture to the new category of laptops called ultrathins, which resemble the MacBook Air and Dell Adamo but are about half the cost.

A separate series of new chips for Netbooks, codenamed Pine Trail, will also appear by early 2010 and feature a high level of integration.

The first Core i7 mobile processors will arrive by September or October. This quad-core series, codenamed Clarksfield, will be for high-end gaming laptops and mobile workstations. (For the codename buffs who actually keep track of these things, Calpella is the platform for Clarksfield, Westmere is the platform for Arrandale.)

Speculation about a rumored Apple tablet may be an exercise in futility, but it is an interesting exercise nonetheless. In this case, my speculation will extend to what may be inside an Apple tablet.

Will the design philosophy spring from the notion of an upsized iPhone or a downsized MacBook? I believe it will be the former since this is a more natural evolution of the hardware and software. But I will entertain both options.

Because this tablet is rumored to appear in 2010, the Intel silicon possibility--however remote--is, I believe, as follows.

First scenario: Intel's in a tablet with laptop lineage. This will offer higher performance and better power savings than the current Atom processor--which is Intel's most power-stingy chip technology. Pine Trail integrates a graphics processor onto the same piece of silicon as the main processor--a first for Intel. (Intel's future "Arrandale" Core i series mobile processor, in contrast, will put the main processor and graphics into the same chip package, not onto the same chip.)

Intel's next-generation integrated graphics silicon technology is largely unknown. But tablets should deliver graphics performance that doesn't disappoint, as this is a shortcoming often brought up by critics of Netbooks.

A real tablet based on a 600MHz ARM processor: the Archos 7

(Credit: Archos)

The more likely non-Intel tablet.

Second scenario: Apple's ARM silicon in an upsized iPod/iPhone. This seems a much more likely scenario than Intel silicon. The that, according to reports, runs at 600MHz. How Apple would tweak this design for a tablet is so highly speculative that I will not hazard much of a guess.

Suffice to say, inside of Apple there is more intellectual capital invested in ARM-based designs than Intel-based ones because of the and the success of the iPhone. And the fact that the iPhone's ARM processor has "Apple" stamped on it should not be overlooked.

Here's the guess that I will hazard: a faster processor analogous to Qualcomm's ARM-based 1GHz Snapdragon processor. that they had co-developed a 1GHz chip similar to the processor that currently powers the iPhone 3GS. And this is the same kind of processor that Qualcomm is targeting for , which could be either a Netbook or tablet.

Freescale's concept "smartbook" tablet

(Credit: Freescale)

Graphics is less clear but U.K.-based Imagination Technologies provides the PowerVR graphics core inside the iPhone's ARM silicon. And Apple has expressed a keen interest in Imagination in the chip design firm to 9.5 percent.

And as a final thought, it is interesting to note that speculation about an Apple "iPad" has gone beyond mere individuals to . Do they know something that we don't?

Waiting for a Core i7 laptop? While Intel is slated to release its first mobile "Nehalem" Core i7 processor in the coming months, the desktop counterpart has already spawned a cottage industry of benchmark-busting laptops.

"It's completely revitalized the desktop replacement laptop," said Kelt Reeves, president of enthusiast PC maker Falcon Northwest, referring to designs that have shoehorned a desktop Core i7 processor into a laptop enclosure.

At the very high end of Falcon Northwest's lineup, interest has shifted to models with the Core i7 processor and away from models oriented around extreme-performance graphics cards, Reeves said.

Falcon Northwest laptop can use Core i7 processors running at speeds up to 3.33GHz

(Credit: Falcon Northwest)

For instance, the Falcon Northwest FragBook DRX Core i7-based models come with Nvidia's lower-performance GeForce GTX 280M graphics processor instead of the higher-end Scalable Link Interface (SLI) technology, which uses two graphics chips. But performance has actually improved in many cases, Reeves said.

"It's a much better balance of a very-high-powered CPU and a very-high-powered graphics card," he said.

Only at the highest settings in popular games like Crysis and World in Conflict did laptops using older Intel Core 2 processors with SLI graphics offer any competition to the Core i7 models, according to Reeves.

AVADirect Clevo D900F Core i7 laptop: a lot of processing power means a lot of fans (count 'em: 4)

(Credit: CNET Reviews)

But it may be too charitable to call these laptops. Sheer size and heat dissipation requirements almost defy laptop categorization. "There's a huge set of heat pipes and copper cooling fins and fans needed to duct out all that power," Reeves said.

Falcon Northwest is not the only company selling large luggable, heat-spewing laptops. CNET Reviews looked at the AVADirect Clevo D900F Core i7 laptop with the same Nvidia graphics processor and said that "the D900F handily topped all of the other performance laptops we've tested. Its processing results were more on par with the Alienware Area-51 X58 gaming desktop (using a 3.2GHz Intel Core i7 chip)."

Smooth Creations and CyberPower, among others, also offer laptops based on the Core i7 processor.

So when will the real deal appear? The first processor designated officially as a Nehalem mobile processor from Intel is expected to emerge by October. Code-named Clarksfield, it will be a quad-core processor, like the current desktop i7, but not impose the kind of thermal stress on the laptop enclosure that the current i7 does. Clarksfield is expected to have a thermal envelope (referred to as Thermal Design Power) that is below half of the current i7, which is rated at 130 watts for the highest-end processor.

Benchmark results for the Falcon Northwest Core i7 laptop are here.

Core i3, i5, i7. A straightforward, if not insipid, branding scheme, right? Wrong. Those alphanumeric identifiers are fighting words.

Last week, Intel announced a new branding scheme for its upcoming processors. In a blog, spokesman Bill Calder wrote that the branding will be "simplified into entry-level (Intel Core i3), mid-level (Intel Core i5), and high-level (Intel Core i7)." Intel calls the "i" suffix an identifier.

The upcoming Lynnfield chip for desktop PCs, for example, will be available as either Intel Core i5 or Intel Core i7 depending upon the feature set and capability. The upshot of the new branding is to make it easier for less tech-savvy consumers to readily identify classes of Intel chips based three simple identifiers, according to Calder.

But judging by the tenor of many of the comments attached to Calder's brand structure blog, you would think the chipmaker had committed high treason.

In the minds of some, it did. The shortcomings of the current naming scheme notwithstanding, many tech-savvy consumers have gotten used to it. For example, Core 2 Quad means a chip built on the Core 2 architecture with 4 processing cores. Core 2 Duo indicates two cores.

One of the most common criticisms cited in the comments section is that i3, i5, and i7 are too vague. "Above all, I'd like to see...at a glance how many cores and what features they have (or have not)," one comment said. Another comment suggested that Intel add more identifiers. For example, Intel Core i5 4100, where 4 is the number of cores and 100 is a speed rating.

Yet another idea was this: Intel/name/number/year, where "name" is the product name, "number" is a bigger-is-better ranking, and "year" the year the architecture was released.

And another: "Either ditch the Celeron, Pentium and Xeon names completely or embrace them completely. These are fairly well known as the 'good, better, best'."

Updated at 12:15 p.m. PDT: adding Centrino and Deborah Conrad discussions.

Intel has spelled out its branding for the upcoming Core series of processors including the "Lynnfield" and "Clarksfield" chips. The chipmaker also said that "Centrino" will be phased out as a PC brand.

In a post Wednesday on Intel's Web site, spokesman Bill Calder wrote that the branding will be "simplified into entry-level (Intel Core i3), mid-level (Intel Core i5), and high-level (Intel Core i7)."

Calder added that it is "important to note that these are not brands but modifiers to the Intel Core brand that signal different features and benefits."

The upcoming Lynnfield chip (desktop) will be available as either Intel Core i5 or Intel Core i7 depending upon the feature set and capability, Calder wrote. Clarksfield (mobile) will have the Intel Core i7 name.

Deborah Conrad, vice president and director of corporate marketing at Intel, talks about new branding strategy via video on Intel Web site

Arrandale (32-nanometer mobile) will appear as the Core i3 but will ultimately span the Core brand to include Core i3, Core i5, and Core i7. Clarkdale (32-nanometer desktop) will be available under the Core i3 and Intel Core i5 brands, Calder said.

The widely-used Centrino moniker will be phased out as a PC brand, according to Calder. Centrino "will be used as a name for Wi-Fi and WiMAX products" and "still be in market on mobile PCs into next year," he said. But eventually will be discontinued.

"In the back half of this year you'll begin to see Core i5 and more Core i7s coming to market. Then by the first part of next year you'll begin to see Core i3, and i5, i7," said Deborah Conrad, vice president and director of corporate marketing at Intel, speaking in a video posted on Intel's Web site. "Then the old names will get retired as those products get phased out," she said.

Intel also disclosed other branding. "We will still have Celeron for entry-level computing at affordable price points, Pentium for basic computing, and of course the Intel Atom processor for all these new devices ranging from netbooks to smartphones," according to the post. "For PC purchasing, think in terms of good-better-best with Celeron being good, Pentium better, and the Intel Core family representing the best we have to offer," he wrote.

"We are focusing our strategy around a primary 'hero' client brand which is Intel Core. Today the Intel Core brand has a mind boggling array of derivatives (such as Core 2 Duo and Core 2 Quad, etc). Over time those will go away and in its place will be a simplified family of Core processors," Calder wrote.

Calder continued: "This will be an evolutionary process taking place over time, and we acknowledge that multiple brands will be in the market next year including older ones, as we make the transition."

Despite being slammed by the financial crisis, Intel is not slowing down. It made this crystal clear in a chip technology briefing on Tuesday, putting rivals on notice that the competition will only get more intense.

The world's largest chipmaker is accelerating introduction of new chips, particularly silicon targeted at laptop computers. Intel is achieving this by moving quickly to processors based on next-generation 32-nanometer manufacturing process technology and investing heavily to keep its most advanced chip factories humming, as CEO Paul Otellini pointed out in a speech in Washington, D.C., earlier today.

In a nutshell, this means Intel may move further ahead of the competition as it uses its deep pockets to advance to the newest generation of processors sooner. It also means a renewed emphasis on packing more features--such as better graphics--into mobile chips, particularly those going into laptops.

Intel is moving graphics into the same package as the processor.

(Credit: Intel)

"The trend toward notebooks is one of the most important megatrends," said Stephen Smith, vice president and director of business operations for Intel's Digital Enterprise Group. Smith spoke Tuesday in San Francisco during the chip road map briefing, which was also available via teleconference.

Intel will bring out a 32-nanometer mobile processor code-named Arrandale in the fourth quarter of this year that integrates graphics silicon into the same chip package as the main processor or CPU. This is a first for Intel--which to date had offered graphics in a separate chip package. This 32-nanometer dual-core chip was previously expected to appear in 2010.

Another mobile chip due this year, code-named Clarksfield, will pack four cores. This will use current 45-nanometer technology.

Intel road map

(Credit: Intel)

Both chips will be based on Intel's new Nehalem microarchitecture, currently used in Core i7 desktop processors.

Smith also reiterated another important technological thrust at Intel when speaking about these upcoming chips: de-emphasizing raw chip speed--usually stated in megahertz or gigahertz--and focusing on "hyper-threading"--or designing chips to handle more than one task at a time without adding more physical processing cores. A thread constitutes a task.

"Clock speeds will stay about the same (as current chips)," Smith said.

Smith also spoke about Westmere, which is Intel's broader term for the effort to move current Nehalem processors (currently marketed as the Core i7) to 32-nanometer technology.

On the server front, an announcement is "imminent" of its first Nehalem processors for servers code-named Nehalem EP, according to Smith. These quad-core processors are designed for servers that have two "sockets"--providing a total of eight processing cores per server.