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During Intel's earnings conference call on Tuesday, CEO Paul Otellini talked about the growth of notebook PCs versus Netbooks, and Windows 7 adoption in business, among other topics.

Otellini was quick to trumpet the fact that its mainstream notebook business beat Netbook growth. "We saw the sequential unit growth rate of notebook processors and chipsets actually exceed the growth rate of Atom processors and chipsets," he said.

Later in the call, Otellini said: "While Atom and Netbooks are important growth drivers for us, our traditional notebook business remains one of the primary drivers of revenue growth and we expect that to continue in the future."

Otellini, again in the call, expanded on this theme, adding that while Netbooks should see significant growth in 2010 over 2009, the notebook market is flourishing. "We're still bullish (on Netbooks) but what we've seen this quarter though is that the notebook market is alive and well and Netbooks are market-additive for Intel and the industry," he said. "Market-additive" is code for an ancillary product, not a mainstream product.

Intel CEO expects more attractive ultra-thin laptops in the coming months

(Credit: Intel )

He also addressed the new category of ultrathin laptops, which are inexpensive laptops--between $500 and $900--that slot in above Netbooks. "The bulk of the units that have shipped to date were single-core versions of the products. Late last quarter, we introduced the dual-core version of those products. You'll see a number of laptops show up in retail with the dual-core versions for the holiday season...more ergonomically designed, thinner, lighter."

Responding to analyst questions, Otellini also addressed Windows 7 adoption in business. "We see a lot of interest at corporations around Win 7 and the new Nehalem-based (PC models)," he said, referring to Intel's new Nehalem-based Core "i" series of processors. "They're made for each other in terms of the performance and power management and security characteristics."

He continued: "I would expect that the (corporate Windows 7) evaluation process will happen over the rest of this year and we'll start seeing corporate purchases on a refresh basis begin in 2010."

Here's a rundown of other comments:

• Consumer segment strong: "The strength in our business remains primarily consumer driven with broad-based demand across all geographies."--Otellini.
  
• Growth phase: Refuting a question about Intel becoming "smaller" next year: "We're finished with the cutting phase of our efficiency efforts and now in the growth phase of that efficiency efforts."--Chief Financial Officer Stacy Smith.
  
• Inventory hubs: At large PC customers, component inventories levels are at roughly half of the peak level late last year and approximately flat throughout 2009. Intel has a better handle on inventories now using a mechanism called inventory hubs. "We hold the inventory for our large OEM customers, who then pull inventory only if needed...This give us increased visibility into real-time production levels."--Otellini
  
• Nehalem server processors: (dual-processor). "It's not so much an upgrade cycle that's driving the volume right now, it's economics of the data center. People are looking at swapping eight to nine older-generation servers for a single Nehalem server."--Otellini.
  

Qualcomm will offer its FLO TV on a handheld television, putting this existing service on a dedicated device for the first time.

Qualcomm's FLO TV Personal Television

(Credit: Qualcomm)

FLO TV, the Qualcomm-owned provider of a live mobile TV service, unveiled the FLO TV Personal Television on Tuesday, with availability slated for holiday season at retailers.

FLO, or "forward link only" technology, is designed for multicasting a large volume of rich multimedia content cost effectively to wireless subscribers. AT&T and Verizon already offer FLO TV on mobile phones in the U.S.

Qualcomm says the FLO TV Personal Television is "created with the single focus of delivering high-quality TV." The device receives live and time-shifted content with no buffering, downloading or waiting to view content, according to Qualcomm.

Content includes CNBC, Comedy Central, ESPN, ESPNews, Fox, Fox News, Fox Sports, MSNBC, MTV, NBC2Go, NBC, NBC News, NBC Sports, Nickelodeon, CBS, CBS College Sports, and CBS News. (Editors' note: CBS College Sports and CBS News are offerings of CBS, which is also the parent company of CNET News.)

Though handheld TV is still somewhat of an unknown quantity, viewership--like that of more traditional big-screen TV-- tends to spike during major national events, according to Qualcomm. Its service saw a surge in viewers, for example, during March Madness--the NCAA Men's Division I Basketball Championship.

Qualcomm cited market research from TeleAnalytics that projects a broadcast mobile TV market of $2.8 billion and 50 million users in North American by 2013.

FLO TV Personal Television subscription service starts at $8.99 per month and the device will sell for $249.99. Specifications include a 3.5-inch diagonal screen and weight of of just over 5 ounces. Its battery supports more than 5 hours of active FLO TV viewing or 300 hours standby.

The television uses a capacitive touch-screen allowing channel surfing with a finger swipe. It also includes a built-in stand and stereo speakers.

Industry sources are refuting a report claiming that a future fiber-optics technology was an Apple idea that was brought to Intel.

Intel's Jason Ziller showing 'miniaturized' optical module

(Credit: Intel)

Light Peak was an Intel Labs project that the chipmaker was working on before anyone was thinking of using it, according to industry sources close to the issue. Light Peak can carry data at 10 gigabits per second in both directions simultaneously and Intel expects it will reach 100 gigabits per second in the next decade.

Engadget reported last week that Apple "brought the concept to Intel and asked them to create it." Apple did not respond to e-mail queries.

Intel showed the technology to third parties, got feedback, then incorporated the feedback into the next design. Apple is an innovating force in the industry and makes requests that nobody else does and that only helps innovation, the sources added.

Separately, on Tuesday, in an interview, Jason Ziller, director of Intel's optical input-output program office, spoke more about the technology that is expected to be used on future PCs and consumer electronics devices.

"We've been working on optical for many years. Specifically, this technology the last couple of years," he said. "We've developed the technology, we've developed the specifications, documenting the technology, and we have prototype product," he said.

Ziller said Intel will be supplying the core silicon for the technology. "Intel will be supplying the controller chip and then there's also an optical module that does the optical conversion. We developed the (optical module) technology and reference design and it's going to be manufactured by other third party optical manufacturers," he said.

Companies that will be involved in the optical module production and "everything around the module" include Foxconn, Foxlink, Avago, SAE, Iptronics, Corning, Elaser, and Ensphere, according to Intel.

"All of these components will be available next year," Ziller said. "The product that we're developing now, that we're ready to ship next year is based on our current specification. Because there is customer demand for that," he said.

Ziller said initially that products may appear that have both Light Peak and other connectors, such as USB, but that the ultimate goal is to have one single connector technology. "It doesn't change the track that electrical USB 3.0 is on. That's going to continue going forward. What Light Peak allows is that USB 3.0 and, or, other protocols could, down the road, be run over optical in this fashion," he said. USB 3.0 is the next-generation USB technology that would replace the current USB 2.X technology found on virtually all PCs today.

Ziller continued. "So, it complements existing electrical protocols and enhances them to run over optical, maybe over longer cables and also together on the same cable because Light Peak supports multiple protocols running simultaneously," he said. Other connector technologies include FireWire, DVI, DisplayPort, and HDMI.

"In the future, these protocols could also run at higher speeds as they evolve over time," he added.

"We'll be evaluating and looking at it as it comes forward," said Jeff Ravencraft, the USB Implementers Forum president and chairman. "We'll continue to evaluate and work with Jason's team."

As the next generation of Universal Serial Bus technology nears commercial reality, next week's Intel Developer Forum will play host to more USB 3.0-capable devices.

Point Grey Research will show a high-end video camera streaming video to a laptop with USB 3.0 technology

(Credit: Point Grey Research)

A Fujitsu laptop, a high-end video camera, and a solid-state drive using USB 3.0 technology, among other hardware, will be demonstrated at IDF, according an announcement from the USB Implementers Forum on Thursday.

USB technology is now used on virtually all computing devices globally as well as the lion's share of consumer electronics products. Also referred to as "SuperSpeed USB," next-generation USB 3.0 boosts the data transfer rate 10 times over current technology, while also improving power efficiency.

Consumer electronics devices enabled with USB 3.0 are expected in the market late this year or early next. The specification was developed by Intel, Hewlett-Packard, Microsoft, NEC, ST-Ericsson, and Texas Instruments.

On display at IDF, among other things, will be a Fujitsu laptop, the first to use built-in USB 3.0. Inside the Fujitsu laptop will be an NEC Electronics "host controller" chip that will exchange data with an external SuperSpeed USB drive from Buffalo Technology.

And USB 3.0 will be a godsend to video cameras--which often need to transfer gigabytes of video data. A prototype high-performance digital video camera from Point Grey Research will be rolled out that integrates a 3-megapixel Sony "IMX036" CMOS (complementary metal-oxide-semiconductor) image sensor to output 1080p high-definition images at 60 frames per second. This camera will stream uncompressed HD video to a laptop PC through a SuperSpeed USB ExpressCard from Fresco Logic.

Asus will also be present to show off its PC motherboard with SuperSpeed USB. The Asus X58 motherboard uses the same NEC chip and will exchange data with a LucidPort SuperSpeed USB mass storage device running the new USB Attached SCSI Protocol (UASP), which delivers improved performance and reduced latency.

The demonstrations will take place during two USB 3.0 technical sessions at IDF at the Moscone Center, San Francisco, starting on Tuesday.

Intel is expressing Moore's Law anew as packing key technologies into fewer chips. New "Clarksfield," "Arrandale" and "Jasper Forest" processors, among others, will showcase this theme later this month at the Intel Developer Forum.

Intel Vice President Steve Smith discussed the highlights of the annual marquee Intel event that will kick off September 22 in San Francisco in a phone interview on Friday.

"Contrary to speculation that Moore's Law is slowing down or potentially dying, we're here to demonstrate that it's alive and well," Smith said. "Integration gives you a smaller, better, faster, more mobile compute platform," he said. Moore's Law, named after Intel co-founder Gordon Moore, states that the number of transistors that can be placed on an integrated circuit doubles roughly every two years.

This theme will be manifested in a number of new processors including the first mobile processor based on Intel's new Nehalem microarchitecture codenamed Clarksfield and even more highly integrated processors to follow dubbed Arrandale and Clarkdale as Intel moves to its next-generation 32-nanometer manufacturing process.

True to its rich heritage of codenames, IDF can, at times, slide into little more than a series of codename-riddled Power Point slides, with some names sounding frustratingly familiar such as Clarksfield and Clarkdale. But codenames, for better or worse, are part and parcel of IDF.

Intel codename decoder:

• Clarksfield: 45-nanometer Nehalem mobile processor integrating I/O
  
• Clarkdale: 32-nanometer Nehalem desktop chip integrating graphics with CPU
  
• Arrandale: 32-nanometer Nehalem mobile chip integrating graphics with CPU
  
• Moorestown: 32-nanometer system-on-chip Atom for smartphones
  
• Sodaville: 32-nanometer system-on-chip Atom for consumer
  
• Pine Trail: new Atom for Netbooks integrating graphics with CPU
  
• Jasper Forest: 45-nanometer, first Nehalem embedded chip for uses such as storage hardware
  
• Larrabee: Intel discrete graphics chip that will compete with Nvidia, AMD
  
• Westmere: 32-nanometer manufacturing process technology
  

Smith said that Intel's move to the next-generation "Westmere" 32-nanometer manufacturing process will drive even more integration next year. "We have completed development and certification of the 32-nanometer process, which means our factory is fully qualified to run the wafers. And we are actually running Westmere CPU wafers through the factory in support of our Q4 revenue production. Absolutely on track for that Q4 revenue production," he said, referring to commercial production of 32-nanometer processors.

In the more immediate future, Intel will roll out a new mobile processor based on its current 45-nanometer technology. "We just announced Lynnfield (the Core i5 and i7 chips for desktops), Clarksfield is the equivalent product for notebooks," Smith said. "Quad-core, 45-nanometer. Based on Nehalem technology but optimized with power management and integration of the PCI express I/O. Moving from a three-chip solution in the original Nehalem products to two chips--and that is our path going forward." I/O, or input-output, is silicon that enables a processor to talk, and shuttle data, to other parts of the system and peripheral components.

Speaking more specifically about Clarksfield integration, Smith said that "the key elements are integration of memory controller, integration of PCI Express 'gen' 2, power management." Intel will also be talking a lot about a feature called Turbo mode. "Turbo mode is extremely important. If you're not using all the cores, the cores that are not used are powered down. The cores that you are using can run at a faster clock rate with Turbo mode," Smith said.

Smith spoke about the next-generation Atom processor for Netbooks and Nettops, "Pine Trail," too. This chip will also ... Read more

Intel and Microsoft will hold an event next week to discuss collaboration on improvements to Windows 7.

The event, on September 1 in San Francisco, will "share how the two companies collaborated on key enhancements during the development of Windows 7," according to Intel. Steve Smith, vice president and director, Intel's Digital Enterprise Group Operations, and Michael Angiulo, general manager of Windows Planning and PC Ecosystem at Microsoft, will talk at the event. Microsoft plans to launch Windows 7 on October 22.

Windows 7 collaboration will be demonstrated by engineers from both companies, according to Intel. Not surprisingly, Microsoft is working closely with Intel, whose chips will power the vast majority of PCs running Windows 7.

In a blog posted in July, Intel described how Microsoft and Intel "saw unique opportunities to optimize Windows 7 for Intel processor technology" in the areas of performance, power management, and graphics.

The blog discusses improvements to multitasking based on "SMT Parking," which provides additional support to the Windows 7 scheduler for Intel Hyper-threading Technology. With Hyper-threading, the operating system sees a single processor core as two cores (i.e., a dual-core chip becomes a virtual quad-core processor), thus potentially improving multitasking--or doing tasks (threads) simultaneously.

In addition, improvements over Vista for boot and shutdown times have been implemented during the Windows 7 development cycle, according to the blog.

And on Intel's Web site, the chipmaker lists desktop motherboards and associated drivers that have passed logo certification for Windows 7.

Another beneficiary of improved Windows 7 technology: Intel solid-state drives, which are typically faster than hard-disk drives and gaining ground in niche markets such as high-end laptops, gaming PCs, and servers. SSDs will be able to take advantage of Windows 7 technology called the Trim Command. Trim will allow blocks of data to be freed up for reuse to better maintain the performance of the SSD.

Windows 7 will also do more than previous operating systems with graphics via DirectX 11. Advanced Micro Devices has described DirectX 11-related technology that enables games developers to create smoother, less blocky and more organic looking objects in games. And, beyond games, Windows 7 has the potential to turn a graphics processing unit (GPU) from AMD or Nvidia into a general-purpose compute engine, used to accelerate everyday computing tasks like a central processing unit, or CPU. Specifically, "the compute shader" can be used to speed up more common computing tasks. The buzz word used to describe this technology is a mouthful: GPGPU or general-purpose graphics processing unit.

Nvidia is readying silicon that would work with Intel's newest processor design, according to a report. Intel claims Nvidia does not have the legal rights to make companion chips for its newest processors.

In February, Intel alleged in a lawsuit that the 4-year-old chipset license agreement with Nvidia does not extend to Intel's future-generation processors with "integrated" memory controllers, such as its "Nehalem" Core i series of processors.

A chipset is companion silicon to the main processor. Integrated memory controllers are built into the processor itself to increase performance between the processor and memory.

According to a report on Chinese-language Technology Web site HKEPC, Nvidia is planning to bring out a MCP99 chipset that supports Nehalem processors and Intel's Direct Media Interface, or DMI. Nvidia cited DMI back in February as a technology that Intel was trying to prevent it from using.

Despite the report's claims, it is not clear yet whether Nvidia would in fact bring out a chip before the legal matter is settled with Intel.

Nvidia had no comment on the report.

Nvidia's current 9400M Intel-compatible chipset, which is used with Core 2 architecture-based processors, has been successful. It is used in Apple's MacBook and Toshiba's Qosmio lines, for example, and in Netbooks that use the Atom processor.

During Nvidia's July 26 earnings conference call, in response to an analyst's question about building chipsets for Intel's Nehalem processors, Nvidia CEO Jen-Hsun Huang said: "We're not necessarily building chipsets for future Intel buses. We've not commented anything on that and so you are just going to have to wait to see what we come up with," he said. "Our company is...pretty darn clever. There is a lot of ways to skin the cat," he said.

Intel said the matter is being left to the courts. "We tried many times to resolve the conflict but we couldn't resolve it. So we asked the courts to," said Intel spokesman Chuck Mulloy. "By the time something comes to market, hopefully we'll have some resolution," Mulloy said.

The general manager of Intel's mobile group said the chipmaker's next-generation Netbook technology is not delayed, refuting earlier reports.

Reports surfaced this week that Intel's next-generation "Pine Trail" Atom silicon would be delayed. Speaking at the Intel Technology Summit on Wednesday in San Francisco, Mooly Eden, general manager of the Mobile Platforms Group at Intel, said the Netbook silicon is not delayed.

"Pine Trail is on schedule," Eden said.

Eden described Pine Trail as the "next generation of Atom that we are going to put into Netbooks." Pine Trail will integrate a graphics processor directly onto the same piece of silicon as the main processor--a first for Intel. "We are going to integrate the graphics to get better performance," he said. The memory controller, another critical piece of silicon, will also be built onto the same chip as the main processor.

"We are going to ship revenue shipments in the second half of the year," he said of Pine Trail. "You come to IDF and see the maturity of the product," he added, referring to the Intel Developer Forum slated for September.

Reports had claimed that Pine Trail was delayed until next year.

Updated at 8:20 a.m. PDT: Added Intel-Nokia announcement and Intel discussion.

Intel and Nokia announced on Tuesday a wide-ranging deal covering chips, hardware, and software for mobile devices.

The companies said their new "long-term relationship" will focus on developing new chip architectures and software and a new class of Intel-based mobile computing devices. The move is part of a major shift for Intel, which is a giant in PC chips but not a player in cell phones.

Among other aspects, the agreement covers mobile applications and wireless Internet access "in a user-friendly pocketable form factor."

The Intel and Nokia effort includes collaboration in several open-source mobile Linux software projects. Intel will also acquire a Nokia HSPA/3G modem IP license for use in future products.

"We will explore new ideas in designs, materials and displays that will go far beyond devices and services on the market today," Nokia said in a statement.

For Intel, the deal adds momentum to its push into the small device/smartphone space. The Nokia announcement follows a pact announced with LG Electronics in February to collaborate on development of smartphones based on Intel's future "Moorestown" silicon and Linux Moblin software.

In March, Intel also announced a deal with Taiwan Semiconductor Manufacturing Company (TSMC) to cooperate in the manufacture of Atom processors.

Intel's need
The point of all of these announcements is to get Intel-architecture chips into cell phones, a giant worldwide market with well over a billion devices sold in 2008.

And the world's largest chipmaker needs to be a player in this market. Smartphones like Apple's iPhone, the Palm Pre, and T-Mobile's Google Android phone, the G1, are taking on many of the attributes of PCs and are increasingly adept at Web browsing, video streaming, and game playing--not unlike a personal computer.

Toshiba just began selling a smartphone that packs a 1GHz Qualcomm processor.

Texas Instruments and other chipmakers are also readying speedy processors for smartphones next year with two processing cores and enhanced video capabilities. And it was disclosed last week that an Nvidia chip will power Microsoft's Zune HD.

And what do those devices and technologies have in common? They're all powered by chips based on the ARM design.

Why ARM? ARM's approach to designing processors is the opposite of Intel's: power efficiency is paramount, performance secondary. Smartphone chips need to operate within a tiny power envelope, typically well under 0.5 watts and must last all day on one battery charge. Current Intel Atom chips--while relatively fast--draw too much power and are hardly suitable for smartphones.

The irony
Ironically, Intel manufactured an ARM-based chip series for many years called Xscale, which traces its heritage to a design called StrongARM. These chips were used in the Hewlett-Packard iPaq, a leading handheld for a number of years. But Intel sold this business to Marvell in 2006.

The chipmaker's strategy now is to shrink its global-standard x86 PC chip architecture to the point where it can run efficiently in smartphones. That's where Moorestown comes in. Intel claims Moorestown will be suited for high-end smartphones by 2010 and that "Medfield" silicon will make it into standard cell phones by 2011.

Neither Intel nor LG gave a date for availability of the LG device, but it is expected to appear soon after Moorestown is available. Intel is saying that Moorestown will be available in 2009 or 2010, though the second half of 2009 appears increasingly likely.

Under the agreement with TSMC, Intel will port its Atom processor technology to TSMC, which will serve solely as a manufacturer of Atom-related silicon--primarily chipsets.