Is there a downside to squeezing a real graphics processor into a 3-pound, ultra-thin laptop? Not if it's a MacBook Air.
Surprise: higher performance = lower heat
After extensive use of two versions (the January 2008 original and October 2008 refresh) of the MacBook Air, my conclusion is that a decent graphics chip can--over the long haul--not only deliver the expected boost in performance but, surprisingly, contribute to better battery life while, even more surprisingly, bringing down the heat to acceptable levels.
First, let me address the original Air. I have used this version now for about 18 months. Though it has been remarkably reliable, the Intel graphics (housed in the chipset) is its Achilles' heel. And I'm talking about heat problems, not performance shortcomings.
The culprit for me is video-intensive tasks (I don't play games). Any extended video immediately turns up the heat to lap-warming, or much toastier, levels. This can get downright uncomfortable at times. Not only does the bottom of the laptop get hot but the keyboard too.
Nvidia'a graphics-oriented chipset (the GeForce 9400M) and Intel's updated processor used in the new version of the Air brings the heat down to lower levels. Overall, this Air runs cooler and longer with the higher-performance graphics. (The Nvidia 9400M graphics chipset is also used in Netbooks from Lenovo and Samsung.)
I won't repeat the performance benchmarks, which have been amply cited in many reviews on the Web. Suffice to say, Nvidia's 9400M delivers better gaming benchmarks (see second link above) than the Intel graphics in the original Air.
And what about newer versions of Intel's chipset? By comparison, the ultra-thin Dell Adamo, an Air rival, uses a Mobile Intel GM45 Express chipset (the successor to the Intel GMA X3100 graphics used in the original Air) for its graphics. In this review, the Adamo was bested consistently by the Air with Nvidia's chipset.
I also see (which is supported in some reviews) better battery life with newer MBA. Generally, I can squeeze 1.5 to 2.5 hours (depending on what I'm doing) out of the original MBA. With the newer version, it's 2 to 3 hours.
And now that the Air can be had for $1,499 (versus $1,999 for Dell Adamo), it's a fairly reasonable deal. (Remember: the high end version of the MacBook Air debuted at more than $3,000 back in January of 2008.)
Though solid-state drives are in vogue, market forces and technical issues are giving the venerable hard-disk drive new life.
DRAMexchange, a Taipei-based market intelligence firm, said last week that the adoption of solid-state drives by computer vendors has slowed as the price of the NAND chips--the raw material of solid-state drives--has increased. The firm also said that computer makers have been cautious about using solid-state drives because current Windows operating systems are not fully optimized for SSDs.
Numonyx NAND flash chip
(Credit: Numonyx)And the popularity of flash storage is waning in Netbooks. These tiny laptops at one time used solid-state drives almost exclusively. But Acer, Hewlett-Packard, Dell and others are moving en masse to configurations with large hard-disk drives in lieu of smaller-capacity solid-state drives.
SSDs typically offer higher performance--often much higher performance--than hard-disk drives and are more durable since they have no moving parts.
While those merits still apply, lingering doubts about the long-term retention of the data in a solid-state drive is making the hard disk look not quite so passé. Ed Doller, the chief technical officer of Numonyx, a flash memory chip maker which was spun off from Intel and STMicroelectronics last year, addressed this issue in a recent phone interview. Numonyx makes two kinds of flash: NOR, used for storing computer programs, and NAND, used widely as a data storage medium in digital cameras, media players, smartphones, and solid-state drives.
"It's if versus when. With a hard drive it's if it's going to fail. With an SSD, it's when is it going to fail," Doller said, who critiques NAND only because his company is looking for a new storage medium--such as phase change memory--that can overcome some of NAND's inherent limitations.
Doller spoke about an epiphany he had after booting up a 20-year-old IBM AT. "I fired that thing up and it actually booted from the hard drive. If that same computer had been built with a solid-state drive, I can almost guarantee you that would not have worked. It would have lost its information over that period of time," Doller said.
... Read more
Updated at 12:15 p.m. PDT: adding Intel comment and additional discussion about laptop casing.
An analyst said Wednesday that some PC makers are hitting snags as they try to bring out ultra-thin laptops.
"Early production units being built in plastic, with the bottom case being plastic, are cracking," said Broadpoint AmTech analyst Doug Freedman, in a phone interview, referring to discussions he had with original equipment manufacturers (OEMs) and and original design manufacturers (ODMs). Typically ODMs don't market under their brand name but supply devices to OEMs, which then slap on their own brand.
Freedman wrote about the problem in a research note distributed Wednesday morning.
"So, to get that really thin form factor that they're after, they're probably going to have to go with a metal case," he said.
Pricey ultra-thin laptops like the MacBook Air and Dell Adamo are made of metal. Lower-cost ultra-thin laptops are typically made of plastic.
In the report, Freedman refers to ODMs and OEMs trying to bring out laptops based on Intel's "CULV" technology. CULV, or consumer ultra-low voltage, is a strategy Intel launched at Computex in June to engender a category of low-cost ultra-thin laptops that offer the portability of Netbooks but are more powerful--and more expensive. These laptops use low-power "ULV" (ultra-low-voltage) processors, as dictated by the space-constrained, ultra-thin designs.
"ODMs were advising their customers to switch to full-metal cases," Freedman said of his discussions with ODMs. "Cost-reduction features are going to be hard in that form factor on the industrial design side," he said.
Intel issued a statement Wednesday saying that the case problem that Freedman refers to has nothing to with Intel processors. "Case design issues reported to be found by an ODM, not consumers, in early production units for ultra-thin laptops have nothing to do with Intel processors whatsoever. We want to be clear that this is not a CPU design issue," Intel said in a statement.
Freedman said some PC makers are opting for large, 11- and 12-inch Netbooks with the Atom processor--and Nvidia's Ion chipset in some cases--instead of ultra-thin ULV laptops based on Intel's Pentium, Celeron, or Core 2 architectures.
"Just look at Lenovo. They're the guy that is not falling in line with Intel's aspirations of 'we don't want 12-inch Netbooks.'" he said.
This summer, both Samsung and Lenovo will begin marketing 11- and 12-inch class Netbooks, respectively, based on the newest Atom processor and Nvidia's Ion chipset.
Nvidia on Monday confirmed that Samsung will bring out a Netbook based on the graphics chipmaker's Ion chipset, another design that breaks the Netbook mold.
"Ion really transforms these small laptops, like the upcoming Samsung and Lenovo Ideapad S12, into fully capable notebooks," Rene Haas, general manager of notebook products at Nvidia said Monday in a statement.
Ion brings mainstream PC graphics to Netbooks, including 1080p high-definition video support and better gaming, according to Nvidia.
The disclosure of the Samsung Netbook follows the Lenovo IdeaPad S12--due in August--the first Netbook announced from a major PC maker to employ the Nvidia chip.
Upcoming Samsung Netbook based on Nvidia's Ion chipset and Intel Atom processor
(Credit: Nvidia)Though Nvidia would not confirm specifications, Netbook Choice is reporting that the Netbook, branded the Samsung N510, is due in July and will sport an 11.6-inch screen--large for the Netbook category, where screens typically top out at about 10 inches.
The Samsung Netbook would be another manifestation, following the Lenovo IdeaPad S12, of Nvidia's efforts to break the Netbook mold as defined by Intel: a low-performance device with a screen under 11 inches in diagonal size. Nvidia claims designs like Samsung's and Lenovo's are more notebook than Netbook.
Samsung's Netbook bears Nvidia badge
(Credit: Nvidia)"The Netbook term was created by Intel to define a segment offering a limited experience, but with Ion you don't have those same limitations," Nvidia's Haas said. "These systems can handle mainstream gaming, HD video, and new GPU-powered applications. You might as well call them notebooks, because that's what they are."
The N510 will also pack an Intel 1.66GHz N280 Atom processor, according to Netbook Choice. The N280 is Intel's latest Atom processor that, ironically, is offered to Netbook makers with supporting Intel silicon that delivers better graphics performance than previous Intel Atom technology. That Intel feature, however, is not available when a PC maker uses Nvidia's higher-performance Ion silicon that integrates Nvidia's 9400M graphics chip--the same chip used in Apple's MacBook line.
Other Samsung Netbook features include a 160GB hard disk drive, 1GB of memory, and Wi-Fi (draft-n), Bluetooth, and a Webcam, according to Netbook Choice.
Nvidia's Ion is also used in tiny desktop PCs such as the Acer AspireRevo and ASUS eeeTop.
The premium pricing of Apple's Mac Mini desktop is due to its laptop lineage, according to a teardown analysis by iSuppli.
Apple Mac Mini
(Credit: Apple)Though probably not a surprise to Mac Mini connoisseurs, the diminutive desktop bears higher component costs due to its use of parts designed for mobile PCs, iSuppli said in a report released Friday. In short, inside the Mini is a virtual laptop.
The entry-level version of the new-generation Mac Mini carries a bill of materials (BOM) of $376.20, which increases to $387.14 when manufacturing costs are added, iSuppli said. The low-end model in the Mac Mini lineup is priced at $599, "reflecting the relatively thin BOM/manufacturing margins" of Apple's PCs in relation to its lower-cost consumer items, specifically the iPod line, according to iSuppli.
"Unlike most desktop computers from other brands, the Mac Mini and, indeed, Apple's entire Mac line make extensive use of components designed for notebook computers," said Andrew Rassweiler, director and principal analyst for iSuppli. "Apple knows how to make computers better, smaller, and more attractive," he said. "Such an achievement, however, comes at a premium."
This sentiment is echoed in a CNET Reviews write-up of the Mac Mini. "While we're still impressed with the Mac Mini's ability to pack so much into a tight package, Apple can't get away from its PC competitors that offer more features for less money," CNET Reviews said.
That said, mobile components abound. ... Read more
How do I calculate the size of meatballs?--O'Brien asks.
(Credit: 'The Tonight Show' with Conan O'Brien)"How do I calculate the size of meatballs?" That was the title of one of the seminal Intel science projects that late-night comedian Conan O'Brien covered in a segment last night on NBC's "The Tonight Show."
O'Brien was at the Intel International Science and Engineering Fair, billed as the world's largest pre-college science fair. Intel is one of the sponsors of the "The Tonight Show with Conan O'Brien," which launched recently with the retirement (from that show) of Jay Leno.
"Even though Intel is one of the world's largest corporations and they could crush me like a fly, they were nice enough to let me go visit their science fair in Reno, Nev.," O'Brien said.
"1,500 dweebs, nerds, and Poindexters," O'Brien said, describing the high school kids attending the event.
Conan O'Brien interviews science fair participants
(Credit: The Tonight Show with Conan O'Brien)A project of note was a "See Through Camera Jammer." "So if someone has a see-through camera, your device stops them from seeing through people's clothing?" O'Brien asked. "Why would you make this?" The response from the high school kid who did the project: "Because it's illegal." And Conan responded: "But I paid a lot of money for that thing."
He ended the segment with a visit to the meatball size-measuring project. "Of course, not everyone here is a genius. 'How do I calculate the size of meatballs?' This was a $13 million study commissioned by Chef Boyardee," he joked.
The link to "The Tonight Show" replay is here. Note that the Intel segment begins at about the 6:30 marker into the show.
Core i3, i5, i7. A straightforward, if not insipid, branding scheme, right? Wrong. Those alphanumeric identifiers are fighting words.
Last week, Intel announced a new branding scheme for its upcoming processors. In a blog, spokesman Bill Calder wrote that the branding will be "simplified into entry-level (Intel Core i3), mid-level (Intel Core i5), and high-level (Intel Core i7)." Intel calls the "i" suffix an identifier.
The upcoming Lynnfield chip for desktop PCs, for example, will be available as either Intel Core i5 or Intel Core i7 depending upon the feature set and capability. The upshot of the new branding is to make it easier for less tech-savvy consumers to readily identify classes of Intel chips based three simple identifiers, according to Calder.
But judging by the tenor of many of the comments attached to Calder's brand structure blog, you would think the chipmaker had committed high treason.
In the minds of some, it did. The shortcomings of the current naming scheme notwithstanding, many tech-savvy consumers have gotten used to it. For example, Core 2 Quad means a chip built on the Core 2 architecture with 4 processing cores. Core 2 Duo indicates two cores.
One of the most common criticisms cited in the comments section is that i3, i5, and i7 are too vague. "Above all, I'd like to see...at a glance how many cores and what features they have (or have not)," one comment said. Another comment suggested that Intel add more identifiers. For example, Intel Core i5 4100, where 4 is the number of cores and 100 is a speed rating.
Yet another idea was this: Intel/name/number/year, where "name" is the product name, "number" is a bigger-is-better ranking, and "year" the year the architecture was released.
And another: "Either ditch the Celeron, Pentium and Xeon names completely or embrace them completely. These are fairly well known as the 'good, better, best'."
... Read moreThe iPhone, of course, is more than the sum of its parts, but the cost of individual components adds up--to $178.96, to be exact.
A new analysis by iSuppli details the cost of the iPhone 3GS and the motley collection of chips inside.
The entry-level (16GB) version of the iPhone 3GS carries a BOM (bill of materials) cost of $172.46 and a manufacturing expense of $6.50, for a total of $178.96, said Andrew Rassweiler, director and principal analyst, teardown services, for iSuppli, in a statement.
Apple iPhone 3GS major components and cost drivers
(Credit: iSuppli)Service providers are paying more for the low-end iPhone 3G S than the original iPhone 3G, according to Rassweiler. "Although the retail price of the 16GB iPhone 3GS is $199, the same as for the 8GB version of the original iPhone 3G, the actual price of the phone paid by the service provider is considerably higher, reflecting the common wireless industry practice of subsidizing the upfront cost of a mobile phone and then making a profit on subscriptions," he said.
And what are the major cost drivers? The 16GB flash memory chip is the priciest at $24--and reflects the rising cost of flash chips due to supply constraints, according to iSuppli. This part is also available from Samsung. So there could be some second-sourcing (sourcing the part from a second chip supplier) in the future.
The next rung in the cost ladder is the 3.5-inch display module and touch-screen assembly, at $19.95 and $16, respectively.
Below this, is the main Samsung applications processor. Priced at $14.46, it is the fourth most costly component in the iPhone 3GS. ... Read more
Intel and Nokia have more than a few holes in their respective collections of mobile technologies. How far will the collaboration announced Tuesday go to plug the holes and take them to the next technology plane?
Intel senior vice president Anand Chandrasekher
(Credit: Intel)A platitude easily missed in the announcement may be the most revealing statement. Simply, that the two companies create the opportunity to take advantage of each other's expertise.
Nokia makes mobile phones. Intel, the world's largest chipmaker, can't get its chips into mobile phones. On the other hand, Intel makes the silicon that powers the world's PCs. Nokia doesn't have a clue about PCs.
The announcement won't necessarily inspire confidence with its lack of product particulars, but that's not what it's about. "Today is a relationship announcement," said Jeff Orr, senior analyst for mobile devices at ABI Research.
Intel and Nokia are simply agreeing at this stage to collaborate rather than be direct competitors, according to Orr.
Nokia was clear--in a cryptic sort of way--on one point, however: "Today's collaboration is not about smartphones but creating a new class of devices," Kai Oistamo, executive vice president for devices at Nokia, said in a phone interview Tuesday.
Beyond those future devices--presumably powered by Intel silicon--what does Intel get? Initially, the most concrete thing is 3G. "This is a gap for Intel, which has focused on Bluetooth, Wi-Fi, and WiMax," Orr said. "As a result, when future architectures like an Atom platform are developed for MIDs (mobile Internet devices), Netbooks, smartphones, that means vendors will have more flexibility for connectivity."
In short, Intel can build 3G into its chipsets and Intel can compete more effectively in the future with products like the iPhone and Palm Pre that include 3G as standard. Intel-based notebooks and Netbooks, until recently, were rarely offered with 3G as a standard option.
"We're not talking about specific products today but certainly we would not have taken a license (from Nokia) if we didn't have the intention to build a product," Anand Chandrasekher, Intel senior vice president and general manager at the Ultra Mobility Group, said in a phone interview Tuesday, referring to Intel's licensing of Nokia's HSPA/3G modem technology.
And it may be too soon for 4G technologies like WiMax. There are many countries (ABI Research's Orr counts about 100) where 3G is just emerging, so talking about WiMax (a 4G technology) is "very premature for most countries," he said.
... Read moreUpdated at 8:20 a.m. PDT: Added Intel-Nokia announcement and Intel discussion.
Intel and Nokia announced on Tuesday a wide-ranging deal covering chips, hardware, and software for mobile devices.
The companies said their new "long-term relationship" will focus on developing new chip architectures and software and a new class of Intel-based mobile computing devices. The move is part of a major shift for Intel, which is a giant in PC chips but not a player in cell phones.
Among other aspects, the agreement covers mobile applications and wireless Internet access "in a user-friendly pocketable form factor."
The Intel and Nokia effort includes collaboration in several open-source mobile Linux software projects. Intel will also acquire a Nokia HSPA/3G modem IP license for use in future products.
"We will explore new ideas in designs, materials and displays that will go far beyond devices and services on the market today," Nokia said in a statement.
For Intel, the deal adds momentum to its push into the small device/smartphone space. The Nokia announcement follows a pact announced with LG Electronics in February to collaborate on development of smartphones based on Intel's future "Moorestown" silicon and Linux Moblin software.
In March, Intel also announced a deal with Taiwan Semiconductor Manufacturing Company (TSMC) to cooperate in the manufacture of Atom processors.
Intel's need
The point of all of these announcements is to get Intel-architecture chips into cell phones, a giant worldwide market with well over a billion devices sold in 2008.
And the world's largest chipmaker needs to be a player in this market. Smartphones like Apple's iPhone, the Palm Pre, and T-Mobile's Google Android phone, the G1, are taking on many of the attributes of PCs and are increasingly adept at Web browsing, video streaming, and game playing--not unlike a personal computer.
Toshiba just began selling a smartphone that packs a 1GHz Qualcomm processor.
Texas Instruments and other chipmakers are also readying speedy processors for smartphones next year with two processing cores and enhanced video capabilities. And it was disclosed last week that an Nvidia chip will power Microsoft's Zune HD.
And what do those devices and technologies have in common? They're all powered by chips based on the ARM design.
Why ARM? ARM's approach to designing processors is the opposite of Intel's: power efficiency is paramount, performance secondary. Smartphone chips need to operate within a tiny power envelope, typically well under 0.5 watts and must last all day on one battery charge. Current Intel Atom chips--while relatively fast--draw too much power and are hardly suitable for smartphones.
The irony
Ironically, Intel manufactured an ARM-based chip series for many years called Xscale, which traces its heritage to a design called StrongARM. These chips were used in the Hewlett-Packard iPaq, a leading handheld for a number of years. But Intel sold this business to Marvell in 2006.
The chipmaker's strategy now is to shrink its global-standard x86 PC chip architecture to the point where it can run efficiently in smartphones. That's where Moorestown comes in. Intel claims Moorestown will be suited for high-end smartphones by 2010 and that "Medfield" silicon will make it into standard cell phones by 2011.
Neither Intel nor LG gave a date for availability of the LG device, but it is expected to appear soon after Moorestown is available. Intel is saying that Moorestown will be available in 2009 or 2010, though the second half of 2009 appears increasingly likely.
Under the agreement with TSMC, Intel will port its Atom processor technology to TSMC, which will serve solely as a manufacturer of Atom-related silicon--primarily chipsets.
