Speedy USB 3.0 spec to be unveiled

The next-generation USB specification is slated to be introduced later this month.

USB 3.0 SuperSpeed logo as shown at WinHEC 2008

(Credit: Brooke Crothers)

On November 17 the SuperSpeed USB (USB 3.0) Developers Conference, hosted by the USB Implementers Forum in San Jose, Calif., will unveil the USB 3.0 specification to the industry, according to a statement Wednesday from the Implementers Forum.

The USB 3.0 specification, a next-generation high-speed connection standard due in 2009, is significant because all future PCs and devices will use connectors based on it. The spec is also expected to offer 10 times the speed of USB 2.0--used in virtually all PCs introduced in the last few years--or roughly 5 gigabits per second.

Hewlett-Packard, Intel, NEC, NXP Semiconductors, Microsoft, and Texas Instruments are all backers of SuperSpeed USB.

Speaking at the Windows Hardware Engineering Conference (WinHEC) in Los Angeles, USB-IF President Jeff Ravencraft said he expects the final specifications to be made public on November 17.

Intel and Nvidia had been skirmishing over the standard but resolved their differences.