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March 4, 2008 10:32 AM PST

Cooling chips with fluid...from the inside

by Michael Kanellos

CORK, Ireland--Researchers for years have devised cooling systems that sit next to or on top of chips and other hot components. Now, researchers in Ireland are trying to make one for inside these components.

The University of Limerick in Ireland, in conjunction with Cork's Tyndall Institute and other research organizations in the country, is working on a liquid cooling system for inside chip packages. Chip packages are those blue/brown plastic sleeves that surround semiconductors and let them plug into a board. When you look at a chip, you're really looking at the package.

Twirly, whirly silicon impeller blades from Ireland.

(Credit: Michael Kanellos/CNET Networks)

In this system, a chilling liquid would circulate in silicon channels and absorb heat as it passes over hot spots. A rotating component (pictured) would circulate the liquid so that it could absorb heat, release the heat away from the component, and re-enter the channels.

The larger rotary impeller you see here is 5 millimeters in diameter, while the smaller one is 2 millimeters. They are made of silicon. (An impeller, by the way, is a propeller for fluids.) The University of Limerick came up with the idea and the intellectual property. Tyndall, which is a national hardware research institute that works with other universities, fabricated the components. Brendan O'Neill, who runs Tyndall's fabrication center, showed it to me on a recent visit.

If they can pull it off, it could mark a distinct improvement in liquid cooling. The closer you can get to the source of the heat, the better a liquid can cool it off. Right now, companies like IBM and Hewlett-Packard sell servers with liquid cooling, but the cooling systems wrap around components. Internal heat, of course, has been one of the big challenges for computer and chip designers.

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What's new about this?
by pradnesh_mohare March 4, 2008 11:35 AM PST
This has been done since at least a couple of years when a University (forgot which one) put in grooves in the silicon itself and the ends were sealed. That itself was not a brand new idea then. So, what's with News.com reporting this now as a new idea?
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Moving parts
by Mel in Hi March 4, 2008 12:00 PM PST
So, we are just going to add another moving part to break in the machines. And a moving part that can't be replaced without throwing away the processor to boot.

I prefer the idea of heat pipes that was floated before. No moving parts. Or maybe combine the technology of the propane refrigerator with it's no moving parts into a chip sized scale.
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Recycle!
by sroussey March 4, 2008 1:48 PM PST
If there was every a controlled place for recycling, this has got to be it! Chips these days have two problems: they require too much energy, and they give off too much energy. Huh!?! Nanoturbine that energy back into the input of the system, and take a huge bite out of both problems...
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