IBM and 3M today said they will develop new adhesives designed to build silicon towers that will be packaged on 3D semiconductors.
The collaboration--IBM brings the semiconductor know-how and 3M is the adhesive expert--aims to make commercial 3D chips via new materials.
According to IBM, the idea is to stack semiconductors in layers up to 100 chips. These chip stacks would allow for better integration and system-on-a-chip capability. Compute, networking, and memory could be stacked on one processor.
IBM has outlined nanoscale breakthroughs before, but one big hurdle is finding the materials to package these 3D silicon skyscrapers. New adhesives … Read more