This is the sixth in a series of posts from the Hot Chips conference at Stanford University. The previous installments looked at process technology, multicore designs, IBM's Power 6 efforts, Vernor Vinge's keynote address, and Nvidia. Other CNET coverage may be found here. This is sort of an experiment for me; I usually prefer to have time to review my work before I publish it. If you see anything wrong, please leave a comment!
We began Tuesday morning with a session on assorted technology developments.
The first talk was from Sun Microsystems, about the company's Proximity chip-to-chip interconnect technology. Today, to put multiple chips in a package--a common technique in high-end servers, for example--each chip will be individually connected to the package substrate through conductive… Read more