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calpella

Intel laptops for 2009: Netbook chip revamp, rise of CULV

According to Digitimes, Intel's road map for the rest of 2009 is crystal clear and full of code names. Released Tuesday morning, the report shows that Intel is ready to start up-selling consumers on fancier new portable processors later this year across its entire product line. It's a triple-front chip attack on your holiday wallet.

The highest-end ($1,200 and higher) machines will run the long-awaited dual-core "Calpella" platform, which basically refers to better-performing chips. Midrange machines ($700-$1,000) will get CULV-based processors, low-voltage dual-core CPUs that give more of a real notebook performance, … Read more

Intel unveils new cooling tech for ultrathin laptops

Updated on October 24 at 10:20 a.m. with corrected image of Intel laminar jet technology.

Intel wants a laptop to live up to its name.

A computer that sits comfortably, coolly on your lap. The world's largest chipmaker expects a crush of ultrathin laptops from PC makers in 2009 and unveiled cooling technology this week to make sure these svelte air-flow constrained designs stay cool.

To date, cooling technology has focused on keeping the internal components from getting too hot but not the outside of the computer, according to Mooly Eden, general manager of Intel's Mobile … Read more

Nehalem: Intel's near future gets real

Intel has scores of futuristic, potentially game-changing research projects but Nehalem is bet-the-farm reality. The first Nehalem chips--and the first drops of what should become a giant revenue stream--will arrive later this year. So, it is not surprising that real silicon and real systems are starting to appear.

What is Nehalem exactly? The architecture will scale from two to eight processor cores, have faster chip-to-chip communication (Intel calls this technology QuickPath), do a better job of adjusting performance levels to suit power needs, and have a higher level of integration (more logic will be built directly onto the processor die). … Read more